BAW56W,135 NXP Semiconductors, BAW56W,135 Datasheet - Page 10
![DIODE SW HI-SPEED DUAL SOT-323](/photos/5/24/52427/568-umt3_sot-323_sc-70_sot323_sml.jpg)
BAW56W,135
Manufacturer Part Number
BAW56W,135
Description
DIODE SW HI-SPEED DUAL SOT-323
Manufacturer
NXP Semiconductors
Datasheet
1.BAW56235.pdf
(15 pages)
Specifications of BAW56W,135
Voltage - Forward (vf) (max) @ If
1.25V @ 150mA
Current - Reverse Leakage @ Vr
500nA @ 80V
Current - Average Rectified (io) (per Diode)
150mA (DC)
Voltage - Dc Reverse (vr) (max)
90V
Reverse Recovery Time (trr)
4ns
Diode Type
Standard
Speed
Small Signal =< 200mA (Io), Any Speed
Diode Configuration
1 Pair Common Anode
Mounting Type
Surface Mount
Package / Case
SC-70-3, SOT-323-3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
934026020135
NXP Semiconductors
BAV756S_BAW56_SER_5
Product data sheet
Fig 13. Wave soldering footprint BAW56 (SOT23/TO-236AB)
Fig 14. Reflow soldering footprint BAW56M (SOT883/SC-101)
4.60
Reflow soldering is the only recommended soldering method.
4.00
1.20
0.90
R = 0.05 (12 )
0.20
Rev. 05 — 26 November 2007
0.35
0.25
(2 )
(2 )
solder lands
solder paste
2
3.40
2.80
4.50
0.30
0.40
0.50
(2 )
(2 )
(2 )
3
1.20 (2x)
BAV756S; BAW56 series
1
1.30
0.30
solder resist
occupied area
Dimensions in mm
preferred transport direction during soldering
0.30
0.40
0.50
Dimensions in mm
High-speed switching diodes
solder lands
solder resist
occupied area
R = 0.05 (12 )
0.60 0.70 0.80
© NXP B.V. 2007. All rights reserved.
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