BAW56W,135 NXP Semiconductors, BAW56W,135 Datasheet - Page 10

• Manufacturer Part Number: BAW56W,135
• Description: DIODE SW HI-SPEED DUAL SOT-323
• Manufacturer: NXP Semiconductors

Specifications of BAW56W,135

• Voltage - Forward (vf) (max) @ If: 1.25V @ 150mA
• Current - Reverse Leakage @ Vr: 500nA @ 80V
• Current - Average Rectified (io) (per Diode): 150mA (DC)
• Voltage - Dc Reverse (vr) (max): 90V
• Reverse Recovery Time (trr): 4ns
• Diode Type: Standard
• Speed: Small Signal =< 200mA (Io), Any Speed
• Diode Configuration: 1 Pair Common Anode
• Mounting Type: Surface Mount
• Package / Case: SC-70-3, SOT-323-3
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 934026020135

NXP Semiconductors
BAV756S_BAW56_SER_5
Product data sheet
Fig 13. Wave soldering footprint BAW56 (SOT23/TO-236AB)
Fig 14. Reflow soldering footprint BAW56M (SOT883/SC-101)
4.60
Reflow soldering is the only recommended soldering method.
4.00
1.20
0.90
R = 0.05 (12 )
0.20
Rev. 05 — 26 November 2007
0.35
0.25
(2 )
(2 )
solder lands
solder paste
2
3.40
2.80
4.50
0.30
0.40
0.50
(2 )
(2 )
(2 )
3
1.20 (2x)
BAV756S; BAW56 series
1
1.30
0.30
solder resist
occupied area
Dimensions in mm
preferred transport direction during soldering
0.30
0.40
0.50
Dimensions in mm
High-speed switching diodes
solder lands
solder resist
occupied area
R = 0.05 (12 )
0.60 0.70 0.80
© NXP B.V. 2007. All rights reserved.
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