BLF4G10LS-160 NXP Semiconductors, BLF4G10LS-160 Datasheet - Page 2

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BLF4G10LS-160

Manufacturer Part Number
BLF4G10LS-160
Description
RF MOSFET Small Signal LDMOS TNS
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BLF4G10LS-160

Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
0.065 Ohms
Drain-source Breakdown Voltage
65 V
Gate-source Breakdown Voltage
15 V
Continuous Drain Current
15 A
Maximum Operating Temperature
+ 200 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 65 C
Package / Case
LDMOST-3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
BLF4G10LS-160,112
NXP Semiconductors
2. Pinning information
3. Ordering information
4. Limiting values
5. Thermal characteristics
BLF4G10LS-160_1
Product data sheet
1.3 Applications
I
Table 2.
[1]
Table 3.
Table 4.
In accordance with the Absolute Maximum Rating System (IEC 60134).
Table 5.
Pin
1
2
3
Type number
BLF4G10LS-160 -
Symbol
V
V
I
T
T
Symbol
R
D
stg
j
DS
GS
th(j-case)
RF power amplifiers for GSM, GSM EDGE and CDMA base stations and multi carrier
applications in the 800 MHz to 1000 MHz frequency range.
Connected to flange
Pinning
Ordering information
Limiting values
Thermal characteristics
Parameter
drain-source voltage
gate-source voltage
drain current
storage temperature
junction temperature
Parameter
thermal resistance from junction
to case
Description
drain
gate
source
Package
Name
Rev. 01 — 19 June 2007
Description
flanged LDMOST ceramic package; 2 mounting holes; 2
leads
Conditions
Conditions
T
[1]
case
P
P
L
L
Simplified outline
= 50 W
= 130 W
= 80 C
BLF4G10LS-160
UHF power LDMOS transistor
1
2
3
Typ
0.49
0.38
Symbol
Min
-
-
-
© NXP B.V. 2007. All rights reserved.
0.5
65
Max
0.58
0.47
2
Max
65
+15
15
+150
200
sym112
Version
SOT502A
1
3
Unit
K/W
K/W
2 of 15
Unit
V
V
A
C
C

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