TGF2022-48 TriQuint, TGF2022-48 Datasheet
TGF2022-48
Specifications of TGF2022-48
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TGF2022-48 Summary of contents
Page 1
... The maximum power added efficiency is 58% which makes the TGF2022-48 appropriate for high efficiency applications. The TGF2022-48 is also ideally suited for Point-to-point Radio, High-reliability space, and Military applications. The TGF2022-48 has a protective surface passivation layer providing environmental robustness ...
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... TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com www.triquint.com TABLE I MAXIMUM RATINGS Parameter 1/ TABLE II DC PROBE CHARACTERISTICS = 25 °C, Nominal Minimum - - -1.5 -30 -30 Product Datasheet September 7, 2007 TGF2022-48 Value 12 2250 dBm See note 3 150 °C 320 °C -65 to 150 °C Typical Maximum Unit 1440 - mA ...
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... TABLE IV THERMAL INFORMATION Test Conditions Idq = 360 mA Pdiss = 4.32 W Product Datasheet September 7, 2007 TGF2022- GHz Vd = 10V Vd = 12V Idq = 360 mA Idq = 360 mA 37.1 37.7 41.5 37.0 8.3 8.0 0.911 ∠173.9 0.917 ∠173.4 38.3 37.1 46.0 42.5 8 ...
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... Product Datasheet September 7, 2007 TGF2022-48 L Drain Unit pHEMT cell Reference Plane Source Gate UPC Source Vd = 10V Vd = 12V Idq = 60mA Idq = 45mA 0.23 0.24 0.24 0.46 0.45 ...
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... Gate Pads (8x) TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com www.triquint.com Linear Model for 4.8mm pHEMT L - via = 0.0135 nH (9x UPC 7 10 UPC 6 11 UPC 5 12 UPC 4 13 UPC 3 14 UPC UPC 2 15 UPC 1 16 Product Datasheet September 7, 2007 TGF2022-48 Drain Pads (8x) Rev - 5 ...
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... Product Datasheet September 7, 2007 TGF2022-48 s12 ang s22 s22 ang deg dB deg 12.13 -4.759 -167.50 4.39 -4.554 -171.69 0.99 -4.470 -172.31 -1.27 -4.388 -172.05 -3 ...
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... Bond pads #9-16: (Drain) 0.090 x 0.090 (0.004 x 0.004) Bond pad #17: (Vg*) 0.090 x 0.090 (0.004 x 0.004) Bond pad #18: (Vg*) 0.090 x 0.090 (0.004 x 0.004) *Note: Bond pads #17 & 18 are alternate gate pads that can be used for paralleling FETs. Product Datasheet September 7, 2007 TGF2022-48 7 Rev - ...
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... Aluminum wire should not be used. • Devices with small pad sizes should be bonded with 0.0007-inch wire. • Maximum stage temperature is 200 °C. TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com www.triquint.com Assembly Process Notes Product Datasheet September 7, 2007 TGF2022-48 8 Rev - ...