MT9M131C12STC Aptina LLC, MT9M131C12STC Datasheet - Page 12

• Manufacturer Part Number: MT9M131C12STC
• Description: SENSOR IMAGE 1.3MP CMOS 48-CLCC
• Manufacturer: Aptina LLC
• Type: CMOS Imagingr
• Series: DigitalClarity®r

Specifications of MT9M131C12STC

• Pixel Size: 3.6µm x 3.6µm
• Active Pixel Array: 1280H x 1024V
• Frames Per Second: 15
• Voltage - Supply: 2.5 V ~ 3.1 V
• Package / Case: 48-CLCC
• Sensor Image Color Type: Color
• Sensor Image Size: 1280x1024Pixels
• Operating Supply Voltage (min): 2.5V
• Operating Supply Voltage (typ): 2.8V
• Operating Supply Voltage (max): 3.1V
• Operating Temp Range: -30C to 70C
• Package Type: CLCC
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 557-1251 - KIT HEAD BOARD FOR MT9M131557-1246 - KIT DEV FOR MT9M131
• Lead Free Status / RoHS Status: Compliant, Lead free / RoHS Compliant
• Other names: 557-1312

Package Dimensions
Figure 9:
PDF:09005aef824c90f2/Source: 09005aef824c90f9
MT9M131_LDS_2.fm - Rev. A 3/07 EN
DIMENSIONS APPLY
TO SOLDER BALLS
POST REFLOW.
THE PRE-REFLOW
DIAMETER IS Ø0.33
SEATING
PLANE
4.50
0.10 A
44X Ø0.35
0.75 TYP
2.25
A
44-Ball iCSP Package
4.15 ±0.05
Notes:
SOLDER BALL MATERIAL: 62% Sn, 36% Pb, 2%Ag OR
8.300 ±0.075
0.75 TYP
4.50
C L
BALL A7
1. An IR-cut filter is required to obtain optimal image quality.
2. All dimensions are in millimeters.
The MT9M131 comes in two packages: the 44-ball iCSP package, shown in Figure 9, and
the 48-pin CLCC package, shown in Figure 10 on page 13.
THESE DIMENSIONS ARE NON-ACCUMULATIVE
(FOR REFERENCE ONLY)
SUBSTRATE MATERIAL: PLASTIC LAMINATE
2.25
SOLDER MASK DEFINED BALL PADS Ø 0.27
0.175 (FOR REFERENCE ONLY)
BALL A1
0.22
96.5% Sn, 3%Ag, 0.5 Cu
C L
ENCAPSULANT: EPOXY
4.15 ±0.05
BALL A1 ID
8.300 ±0.075
B
0.375 ±0.075
0.575 ±0.050
0.950 ±0.075
MT9M131: SOC Megapixel Digital Image Sensor
1.17 ±0.10
12
BALL A1
CORNER
REFERENCE
Micron Technology, Inc., reserves the right to change products or specifications without notice.
4.134 ±0.075
OPTICAL AREA
OPTICAL
CENTER
MAXIMUM ROTATION OF OPTICAL AREA RELATIVE TO PACKAGE EDGES: 1º.
MAXIMUM TILT OF OPTICAL AREA RELATIVE TO PACKAGE EDGE
MAXIMUM TILT OF OPTICAL AREA RELATIVE TO TOP OF COVER GLASS: 0.3º.
LID MATERIAL: BOROSILICATE GLASS 0.40 THICKNESS
IMAGE SENSOR DIE
ONLY)
0.016
(FOR
4.112 ±0.075
REFERENCE
0.038 TYP
ONLY)
(FOR
4.608 CTR
6.47 CTR
Package Dimensions
©2007 Micron Technology, Inc. All rights reserved.
Preliminary
3.686
CTR
FIRST
CLEAR
PIXEL
PACKAGE
CENTER
6.47
B
CTR
0.3º.