KMA200,115 NXP Semiconductors, KMA200,115 Datasheet
KMA200,115
Specifications of KMA200,115
934056510115
KMA200 T/R
Available stocks
Related parts for KMA200,115
KMA200,115 Summary of contents
Page 1
KMA200 Programmable angle sensor Rev. 07 — 18 July 2008 1. Product profile 1.1 General description The KMA200 is an angle sensor system. The MagnetoResistive (MR) element and the mixed signal Integrated Circuit (IC) are integrated in one package. This ...
Page 2
... NXP Semiconductors 1.3 Quick reference data Table 1. Quick reference data Symbol Parameter V supply voltage DD V programming supply voltage DD(pr) T ambient temperature amb T programming ambient temperature amb(pr) C load capacitance L R pull-up load resistance L(pu) R pull-down load resistance L(pd) C external capacitance between V ext ...
Page 3
Functional diagram MR-SENSOR ELEMENT DEC.-FIL. DEC.-FIL. 1 COUNTER BIAS cosine bridge INSTR.- AMP. sine bridge INSTR.- AMP. ANALOG INPUT STAGE Fig 1. Functional diagram DIGITAL PART WATCHDOG- ROM TIMER EEPROM + / /AND/OR CALIBRATION SERIAL MICROCONTROLLER INTERFACE TEMP. OSC, ...
Page 4
... NXP Semiconductors 5. Functional description The KMA200 amplifies two orthogonal sinusoidal signals delivered by the MR-sensor element and converts them into the digital domain. Using the COordinate Rotation DIgital Computer (CORDIC) algorithm, the angle is calculated. Angle output is either analog or digital. The KMA200 comprises diagnostic features that ensure a complete online supervision of all essential functional blocks including verifi ...
Page 5
... NXP Semiconductors 6. Diagnostic features The KMA200 includes diagnostic features to ensure the validity of its output signals. The diagnostic features can be configured with the control information words (ctrl) written to the user-programmable EEPROM. In the analog output modes a diagnostic error condition is signaled to the user by setting the outputs into the high-impedance state ...
Page 6
... NXP Semiconductors Diagnosis of input stage For diagnosis of the input stage, the calibration microcontroller calculates the expected signal magnitude using the temperature information and the EEPROM constants and compares it to the signal magnitude based on the current measurement. If the difference of the two magnitudes is greater than an allowed deviation, an error condition is signaled to the user ...
Page 7
... NXP Semiconductors Oscillator fail-safe circuit The function of the free-running oscillator is checked with re-triggered mono flop. If the mono flop is not triggered, the KMA200 signals an error. device situation Fig 2. KMA200_7 Product data sheet V modes DD undefined 32 V reset high overvoltage 26.5 V protection reset 13 V low overvoltage ...
Page 8
... NXP Semiconductors 7. Outputs of KMA200 The output of the KMA200 is either digital or analog, depending on the control word stored in the EEPROM. The analog output consists of a standard and a programmable output stage. The programmable output stage allows four different characteristics; mode 1, mode 2, mode 3 or none output. The digital output has two different modes; mode 5 and mode 6 ...
Page 9
... NXP Semiconductors Fig 3. Fig 4. KMA200_7 Product data sheet OUT1 DD 100 % (CL)u V (CL Standard analog output mode OUT2 DD 100 % (CL)u V (CL Inverted analog output (mode 1) Rev. 07 — 18 July 2008 Programmable angle sensor diagnostics area (180 max diagnostics area 180 max diagnostics area ...
Page 10
... NXP Semiconductors Fig 5. Fig 6. KMA200_7 Product data sheet V /V OUT2 DD 100 % diagnostics area (CL (CL diagnostics area 0 0 Half range output mode (mode OUT2 DD 100 % HIGH OUT1 thresh Comparator analog output (mode 3) Rev. 07 — 18 July 2008 KMA200 Programmable angle sensor (180 )/2 max ...
Page 11
... NXP Semiconductors 8. Digital output (SPI) Standard digital output If the standard digital output mode is configured, output data can be read with the serial interface. enclosed by a HIGH-to-LOW and LOW-to-HIGH transition of CS. DATA are clocked out at the falling edge of CLK and should be evaluated at the rising edge. The output data consist of 3 bytes (24 bits). The fi ...
Page 12
... NXP Semiconductors 9. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage DD V voltage on pins X T ambient temperature amb T programming ambient temperature amb(pr) T storage temperature stg EEPROM t retention time ret N write or erase endurance ...
Page 13
... NXP Semiconductors 10. Characteristics Table 7. Characteristics In homogenous magnetic field at saturation field strength of minimum 35 kA/m and external capacitance C and GND +160 C; V amb Symbol Parameter Supply voltage and operation currents V supply voltage DD V programming supply voltage DD(pr) I supply current DD C load capacitance L R pull-up load resistance ...
Page 14
... NXP Semiconductors Table 7. Characteristics …continued In homogenous magnetic field at saturation field strength of minimum 35 kA/m and external capacitance C and GND +160 C; V amb Symbol Parameter Analog programmable output V V nominal output voltage range on OUT2(nom) pin OUT2 V lower diagnostic range output O(ldr) voltage V upper diagnostic range output ...
Page 15
... NXP Semiconductors Table 7. Characteristics …continued In homogenous magnetic field at saturation field strength of minimum 35 kA/m and external capacitance C and GND +160 C; V amb Symbol Parameter Analog programmable output V V nominal output voltage range on OUT2(nom) pin OUT2 V lower diagnostic range output O(ldr) voltage V upper diagnostic range output ...
Page 16
... NXP Semiconductors Table 7. Characteristics …continued In homogenous magnetic field at saturation field strength of minimum 35 kA/m and external capacitance C and GND +160 C; V amb Symbol Parameter On-chip temperature sensor characteristics T sensor temperature sen T sensor temperature resolution sen(res) T sensor temperature accuracy sen T warning temperature resolution ...
Page 17
... NXP Semiconductors 11. Error codes Table 8. A[1: Standard digital output A[12:0] Temperature = T[6:0] Complement digital output A[12:0] Temperature = T[6:0] KMA200_7 Product data sheet Error codes Description diagnosis error diagnosis error (input stage) over-temperature warning (not occupied) 180 ---------- - A[12:0] 0.022 180 ---------- - A[12:0] 0.022 ...
Page 18
... NXP Semiconductors 12. Definition of errors 12.1 General For the accuracy is assumed that the sensor operates in a homogeneous magnetic field at saturation field strength H mechanical reference point at room temperature (and zero degree). Fig 8. This reference line is valid for digital and analog outputs. The maximum angle is set to 180 and the clamping levels are programmed ...
Page 19
... NXP Semiconductors 12.3 Temperature drift The temperature drift is defined as the envelope deviation of the angle value over the temperature range considered as the pure thermal effect. Fig 9. Following mathematical description is given for temperature drift value meas KMA200_7 Product data sheet lin ( ) T : temperature drift, deviation over temperature in degree ...
Page 20
... NXP Semiconductors 12.4 Microlinearity Microlinearity is the deviation between the device output and the reference line at any angle and for an angle step The microlinearity is determined at a constant temperature. Fig 10. Microlinearity behavior The microlinearity is calculated as follows lin V ( ideal ref(i+1) : microlinearity lin V ( meas ref( ideal, theoretical slope ...
Page 21
... NXP Semiconductors 12.5 Hysteresis The hysteresis error is defined as the maximum difference between angle values given by the device output when performing a positive (clockwise) rotation and negative rotation (counter clockwise) over an angle range of 180 . Fig 11. Hysteresis The hysteresis error is defined as follows: ...
Page 22
... NXP Semiconductors 13.2 Command mode This mode is used for calibration and programming. The KMA200 is controlled with serial interface commands. To activate the command mode, the following initialization procedure must be executed during power-on reset. The pin CS must be constantly held on HIGH level and pin CLK/OUT2 must be constantly held on LOW level during power-on. This condition has to start during reset and must be valid during the following initialization phase of the KMA200 for at least 1 ms ...
Page 23
... NXP Semiconductors Address B: storage the assembly lot no. (maximum 65535) 13.4 Write RAM (0nh), read RAM (1nh) To write data to the RAM the command byte 0nh (n is the address of the data) followed by the 16-bit data has to be send. To read data from the RAM, the command byte 1nh has to be send activated again, the RAM contents at the specifi ...
Page 24
... NXP Semiconductors Table 9. Address Table 10. Format of zero_angle, angular_range and zero_angle = A[15:0] 0.00275 , angular_range = A[15:0] MSB A[15] A[14] A[13] A[12] A[11] Table 11. Format of T and T shut(res TS[7: and T shut(res) MSB shut(res [7] [6] [5] [4] [3] Table 12. Format of ctrl1 MSB [ [1] EP: EEPROM write protection: default value: 0 ...
Page 25
... NXP Semiconductors Table 13. Format of ctrl2 MSB DI2 [1] DI[2:0]: diagnosis of input stage: default value: 000 000 level < 6.24 mV/V Meas Soll 001 level < 4.68 mV/V Meas Soll 010 level < 3.12 mV/V Meas Soll 011 level < 1.56 mV/V Meas Soll 100 level < 0.78 mV/V ...
Page 26
... NXP Semiconductors 14. ElectroMagnetic Interference (EMI) The following tests are performed with the sensor system KMA200. Details of the measurements and behavior are available on request. 14.1 Emission (CISPR 25) Conducted radio disturbance: tests according CISPR 25, chapter 11 (artificial network). Radiated radio disturbance: test according CISPR 25, chapter 13 (anechoic chamber - component/module) ...
Page 27
... NXP Semiconductors 17. Marking Package is SOT637 Marking paint: laser on package head and package body Letter height: 0.8 mm Marking of package head: batch number Marking of package body: type no., date code (x yyy z for manufacturing Manila, y: day of the year, z: year of production KMA200_7 Product data sheet Rev. 07 — 18 July 2008 ...
Page 28
... NXP Semiconductors 18. Package outline Plastic single-ended multi-chip package; 6 interconnections; 5 in-line leads ( DIMENSIONS (mm are the original dimensions) UNIT 1.65 0.41 1.57 0.31 0.30 mm 1.45 0.34 1.47 0.24 0.24 Note 1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic between and besides the leads. ...
Page 29
... NXP Semiconductors 19. Handling information (1) No bending allowed (2) Plastic body and interface plastic body - leads: application of bending forces not allowed Fig 14. Bending recommendation KMA200_7 Product data sheet (1) 0.7 (1) 0.7 R 0.25 min (2) R 0.25 min Dimensions in mm Rev. 07 — 18 July 2008 KMA200 Programmable angle sensor ...
Page 30
... NXP Semiconductors 20. Revision history Table 15. Revision history Document ID Release date KMA200_7 20080718 • Modifications: Section KMA200_6 20070102 KMA200_5 20050816 KMA200_4 20020325 KMA200_3 20010620 KMA200_2 20000920 KMA200_1 20000907 KMA200_7 Product data sheet Data sheet status Product data sheet 16: The lead finish thickness has been changed. ...
Page 31
... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
Page 32
... NXP Semiconductors 23. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 5 Functional description . . . . . . . . . . . . . . . . . . . 4 6 Diagnostic features . . . . . . . . . . . . . . . . . . . . . . 5 7 Outputs of KMA200 . . . . . . . . . . . . . . . . . . . . . . 8 8 Digital output (SPI Limiting values Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 13 11 Error codes Defi ...