BAP50-03,135 NXP Semiconductors, BAP50-03,135 Datasheet - Page 5

• Manufacturer Part Number: BAP50-03,135
• Description: DIODE PIN GP 50V 100MA SOD323
• Manufacturer: NXP Semiconductors

Specifications of BAP50-03,135

• Package / Case: SC-76, SOD-323
• Diode Type: PIN - Single
• Voltage - Peak Reverse (max): 50V
• Current - Max: 50mA
• Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
• Resistance @ If, F: 5 Ohm @ 10mA, 100MHz
• Power Dissipation (max): 500mW
• Configuration: Single
• Reverse Voltage: 50 V
• Forward Continuous Current: 50 mA
• Termination Style: Solder Tails
• Maximum Diode Capacitance: 0.55 pF
• Maximum Series Resistance @ Maximum If: 5 Ohms
• Maximum Series Resistance @ Minimum If: 40 Ohms
• Mounting Style: SMD/SMT
• Power Dissipation: 500 mW
• Forward Current: 50mA
• Forward Voltage: 1.1V
• Operating Temperature Classification: Military
• Package Type: SOD-323
• Mounting: Surface Mount
• Operating Temperature (max): 150C
• Operating Temperature (min): -65C
• Pin Count: 2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

NXP Semiconductors
8. Abbreviations
9. Revision history
Table 7.
BAP50-03_4
Document ID
BAP50-03_4
Modifications:
BAP50-03_3
BAP50-03_2
BAP50-03_N_1
Product data sheet
Revision history
Table 6.
Acronym
AQL
PIN
SMD
RF
S4
Release date
20090911
20040211
19990510
19990201
•
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
Legal texts have been adapted to the new company name where appropriate.
Abbreviations
Description
Acceptable Quality Level
P-type, Intrinsic, N-type
Surface Mounted Device
Radio Frequency
Special inspection level 4
Data sheet status
Product data sheet
Product data sheet
Product data sheet
Preliminary data sheet
Rev. 04 — 11 September 2009
Change notice
-
General purpose PIN diode
BAP50-03
Supersedes
BAP50-03_3
BAP50-03_2
BAP50-03_N_1
-
© NXP B.V. 2009. All rights reserved.
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