BAP50-03,135 NXP Semiconductors, BAP50-03,135 Datasheet - Page 4

DIODE PIN GP 50V 100MA SOD323

BAP50-03,135

Manufacturer Part Number
BAP50-03,135
Description
DIODE PIN GP 50V 100MA SOD323
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BAP50-03,135

Package / Case
SC-76, SOD-323
Diode Type
PIN - Single
Voltage - Peak Reverse (max)
50V
Current - Max
50mA
Capacitance @ Vr, F
0.35pF @ 5V, 1MHz
Resistance @ If, F
5 Ohm @ 10mA, 100MHz
Power Dissipation (max)
500mW
Configuration
Single
Reverse Voltage
50 V
Forward Continuous Current
50 mA
Termination Style
Solder Tails
Maximum Diode Capacitance
0.55 pF
Maximum Series Resistance @ Maximum If
5 Ohms
Maximum Series Resistance @ Minimum If
40 Ohms
Mounting Style
SMD/SMT
Power Dissipation
500 mW
Forward Current
50mA
Forward Voltage
1.1V
Operating Temperature Classification
Military
Package Type
SOD-323
Mounting
Surface Mount
Operating Temperature (max)
150C
Operating Temperature (min)
-65C
Pin Count
2
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
NXP Semiconductors
7. Package outline
Fig 5.
BAP50-03_4
Product data sheet
Plastic surface-mounted package; 2 leads
DIMENSIONS (mm are the original dimensions)
Note
1. The marking bar indicates the cathode
UNIT
mm
VERSION
OUTLINE
SOD323
Package outline SOD323
1.1
0.8
A
max
0.05
A
1
1
0.40
0.25
b
p
IEC
0.25
0.10
(1)
c
1.8
1.6
D
H
D
D
1.35
1.15
JEDEC
E
REFERENCES
0
H
2.7
2.3
Rev. 04 — 11 September 2009
D
0.45
0.15
2
L
A
p
0.25
0.15
JEITA
SC-76
Q
scale
b
X
v
p
1
M
0.2
v
A
A
2 mm
A
1
detail X
PROJECTION
EUROPEAN
General purpose PIN diode
E
L
BAP50-03
p
© NXP B.V. 2009. All rights reserved.
ISSUE DATE
Q
c
03-12-17
06-03-16
SOD323
4 of 7

Related parts for BAP50-03,135