CY8C3865LTI-014 Cypress Semiconductor Corp, CY8C3865LTI-014 Datasheet - Page 108

• Manufacturer Part Number: CY8C3865LTI-014
• Description: CY8C3865LTI-014
• Manufacturer: Cypress Semiconductor Corp
• Series: PSOC™ 3 CY8C38xxr

Specifications of CY8C3865LTI-014

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 67MHz
• Connectivity: EBI/EMI, I²C, LIN, SPI, UART/USART, USB
• Peripherals: CapSense, DMA, LCD, POR, PWM, WDT
• Number Of I /o: 38
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 1.71 V ~ 5.5 V
• Data Converters: A/D 2x20b, D/A 4x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Technology: CMOS
• Processing Unit: Microcontroller
• Operating Supply Voltage (min): 1.8V
• Operating Supply Voltage (typ): 2.5/3.3/5V
• Operating Supply Voltage (max): 5.5V
• Package Type: QFN EP
• Screening Level: Industrial
• Pin Count: 68
• Mounting: Surface Mount
• Rad Hardened: No
• Processor Series: CY8C38
• Core: 8051
• Data Bus Width: 32 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, SPI, UART, USB
• Maximum Clock Frequency: 67 MHz
• Number Of Programmable I/os: 28 to 72
• Number Of Timers: 4
• Operating Supply Voltage: 0.5 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Controller Family/series: (8051) PSOC 3
• No. Of I/o's: 38
• Eeprom Memory Size: 1KB
• Ram Memory Size: 4KB
• Cpu Speed: 67MHz
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

13. Packaging
Table 13-1. Package Characteristics
Table 13-2. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2
Document Number: 001-11729 Rev. *O
T
T
Tja
Tja
Tja
Tja
Tjc
Tjc
Tjc
Tjc
A
J
Parameter
0.088
0.092
0.025
BSC
25
24
Operating ambient temperature
Operating junction temperature
Package JA (48-pin SSOP)
Package JA (48-pin QFN)
Package JA (68-pin QFN)
Package JA (100-pin TQFP)
Package JC (48-pin SSOP)
Package JC (48-pin QFN)
Package JC (68-pin QFN)
Package JC (100-pin TQFP)
Pb-free assemblies (20s to 40s) –
Sn-Ag-Cu solder paste reflow
temperature
Pb-free assemblies (20s to 40s) –
Sn-Pb solder paste reflow
temperature
100-pin TQFP
48-pin SSOP
48-pin QFN
68-pin QFN
Package
Description
0.620
0.630
Figure 13-1. 48-pin (300 mil) SSOP Package Outline
0.008
0.0135
PRELIMINARY
48
1
0.008
0.016
.020
0.292
0.299
0.095
0.110
0.395
0.420
SEATING PLANE
Conditions
0.004
PSoC
MSL 1
MSL 3
MSL 3
MSL 3
MSL
GAUGE PLANE
®
3: CY8C38 Family Datasheet
.010
DIMENSIONS IN INCHES MIN.
0°-8°
Min
–40
–40
235
205
–
–
–
–
–
–
–
–
0.024
0.040
25.00
45.16
15.94
30.52
27.84
11.72
7.05
6.32
9.04
Typ
–
–
–
Max
100
245
220
85
–
–
–
–
–
–
–
–
MAX.
51-85061-*D
Page 108 of 117
0.005
0.010
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
Units
°C
°C
°C
°C
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