CY62167ELL-45ZXI Cypress Semiconductor Corp, CY62167ELL-45ZXI Datasheet - Page 5

CY62167ELL-45ZXI

CY62167ELL-45ZXI

Manufacturer Part Number
CY62167ELL-45ZXI
Description
CY62167ELL-45ZXI
Manufacturer
Cypress Semiconductor Corp
Datasheet

Specifications of CY62167ELL-45ZXI

Format - Memory
RAM
Memory Type
SRAM
Memory Size
16M (2M x 8 or 1M x 16)
Speed
45ns
Interface
Parallel
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Package / Case
48-TSOP I
Density
16Mb
Access Time (max)
45ns
Sync/async
Asynchronous
Architecture
SDR
Clock Freq (max)
Not RequiredMHz
Operating Supply Voltage (typ)
5V
Address Bus
21/20Bit
Package Type
TSOP-I
Operating Temp Range
-40C to 85C
Number Of Ports
1
Supply Current
30mA
Operating Supply Voltage (min)
4.5V
Operating Supply Voltage (max)
5.5V
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
48
Word Size
8/16Bit
Number Of Words
2M/1M
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Price
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Manufacturer:
CYPRESSRESS
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Manufacturer:
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Manufacturer:
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CY62167ELL-45ZXI
Manufacturer:
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Quantity:
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AC Test Loads and Waveforms
Data Retention Characteristics
Over the operating range
Data Retention Waveform
Notes
Document Number: 001-15607 Rev. *B
V
I
t
t
12. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at V
13. Chip enables (CE
14. Tested initially and after any design or process changes that may affect these parameters.
15. Full device operation requires linear V
16. BHE. BLE is the AND of BHE and BLE. Deselect the chip by either disabling the chip enable signals or by disabling BHE and BLE.
CCDR
CDR
R
DR
CE
BHE. BLE
[15]
Parameter
[14]
1
[13]
or
CE
or
V
CC
2
OUTPUT
Parameters
1
INCLUDING
V
and CE
V
Data retention current
Chip deselect to data
retention time
Operation recovery time –
CC
R
V
CC
R1
R2
JIG AND
TH
TH
SCOPE
for data retention
30 pF
2
), byte enables (BHE and BLE) and BYTE need to be tied to CMOS levels to meet the I
Description
R1
CC
ramp from V
[16]
R2
V
t
CC
CDR
(min)
V
0.2 V, or BHE and BLE > V
V
DR
CC
IN
RISE TIME= 1 V/ns
to V
> V
= V
CC
V
CC
(min) > 100 µs or stable at V
DR
CC
GND
– 0.2 V or V
, CE
EQUIVALENT TO: THÉVENIN EQUIVALENT
Conditions
DATA RETENTION MODE
1
Values
> V
1800
10%
1.77
990
639
CC
OUTPUT
V
IN
DR
– 0.2 V or CE
< 0.2 V
> 2.0 V
ALL INPUT PULSES
CC
90%
CC
– 0.2 V,
(min) > 100 µs.
2
<
R
TH
Min
SB2
2.0
90%
45
0
CC
10%
/ I
CCDR
= V
FALL TIME= 1 V/ns
V
V
CC
CC
t
R
spec. Other inputs can be left floating.
Typ
(typ), T
(min)
CY62167E MoBL
[12]
Unit
A
Ω
Ω
Ω
V
= 25 °C.
Max
12
Page 5 of 15
Unit
µA
ns
ns
V
®
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