AM29LV065DU90REF Spansion Inc., AM29LV065DU90REF Datasheet - Page 8

• Manufacturer Part Number: AM29LV065DU90REF
• Description: Flash Memory IC
• Manufacturer: Spansion Inc.

Specifications of AM29LV065DU90REF

• Memory Size: 64Mbit
• Memory Configuration: 8M X 8
• Ic Interface Type: Parallel
• Access Time: 90ns
• Memory Case Style: TSOP
• No. Of Pins: 48
• Operating Temperature Range: -40°C To +85°C
• Termination Type: SMD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

CONNECTION DIAGRAMS
Special Handling Instructions for FBGA
Package
Special handling is required for Flash Memory products
in FBGA packages.
8
NC*
NC*
NC*
NC*
A8
A7
A1
A2
NC*
NC*
NC*
B8
B7
B1
RY/BY#
WE#
A14
C7
C6
C4
C2
C5
C3
A9
A7
A3
* Balls are shorted together via the substrate but not connected to the die.
RESET#
ACC
A13
A18
D7
D6
D4
D2
D5
D3
A8
A4
A15
A11
A22
E7
E6
E4
NC
E2
E5
E3
A6
A2
Top View, Balls Facing Down
Am29LV065D
63-Ball FBGA
A16
A12
F7
F6
NC
F4
NC
F2
A5
A1
F5
F3
DQ5
DQ2
DQ0
A17
A19
G7
G6
G4
G2
Flash memory devices in FBGA packages may be
damaged if exposed to ultrasonic cleaning methods.
The package and/or data integrity may be compromised
if the package body is exposed to temperatures above
150°C for prolonged periods of time.
G5
G3
A0
DQ3
CE#
A10
H7
NC
H6
NC
H4
NC
H2
H5
H3
DQ6
V
OE#
A20
V
NC
J7
J6
J4
J2
J5
J3
CC
IO
DQ7
DQ4
DQ1
V
A21
V
K7
K6
K4
K2
K5
K3
SS
SS
NC*
NC*
NC*
NC*
L8
L7
L1
L2
February 16, 2006
NC*
NC*
NC*
NC*
M1
M8
M7
M2