AM29F002BT-70JC Spansion Inc., AM29F002BT-70JC Datasheet - Page 42

Flash Memory IC

AM29F002BT-70JC

Manufacturer Part Number
AM29F002BT-70JC
Description
Flash Memory IC
Manufacturer
Spansion Inc.

Specifications of AM29F002BT-70JC

Memory Size
2Mbit
Memory Configuration
256K X 8
Ic Interface Type
Parallel
Access Time
70ns
Memory Case Style
PLCC
No. Of Pins
32
Operating Temperature Range
0°C To +70°C
Termination Type
SMD

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AM29F002BT-70JC
Manufacturer:
AMD
Quantity:
3 366
REVISION SUMMARY
Revision A (Ju ly 1998)
Initia l r ele as e.
Revision B (January 1999)
D istin ct iv e C h ar ac ter istic s
A dde d:
A C C h a r act er is it ic s— R ea d O p er at io n s Ta b le
t
from 2 0 ns
A C C h a r act er is tics— E ra se /P ro g r am Op er a tio ns
t
t
t
A C C h a r act er is tics— A lter n a te C E# C o n t ro lle d
E ra se /P ro g r am Op er a tion s
t
t
t
D C C h ar ac ter istics — TT L /N M O S C o m p a tible
I
s pe c ifi ca tions ar e te s te d w ith V
Co lop hon
T he produc ts described in this document a re designed, developed a nd manufac tured as c ontemplated for genera l use, inc luding w ithout limita tion, ordinar y
industrial use, genera l offic e use, persona l use, and ho usehold use, but a re no t designed, developed and manufac tured as contemplated (1) for
includes
injur y, severe physica l da mag e o r other loss ( i.e., nuc lear rea ctio n control in nuclear fa cility, a irc raft flight co ntrol, air traffic co ntrol, mass transpor t c ontro l,
medic al life suppo rt sy stem, missile launc h c ontro l in weapon sy stem), or ( 2)
a rtificial satellite). Please note that Spa nsio n LLC will no t be lia ble
mentioned uses of the produc ts. Any semico nduc tor dev ic es have an inherent chanc e o f failure. You must protect ag ainst injury, da mag e o r loss from such
failures by inc orpora ting sa fety design measures into your fa cility a nd equipment such a s redunda nc y, fire protec tion, and prevention of o ver- current lev els
a nd other a bno rmal operating co nditio ns. If a ny products described in this do cument represent goods o r tec hno lo gies subject to certain restrictio ns on ex-
por t under the Foreign Exchange a nd F oreig n Tra de Law of Japa
prior a uthoriza tion by
Tra de m arks
C opyrig ht © 2 000-20 04 A dvanced Micro D evices, Inc. All rig hts reserved.
AM D, th e AM D log o, an d com bina tio ns th ere of a re re gistered t rad ema rks o f Advan ced M icro Devices, In c.
ExpressF lash is a t rad em ark of Ad va nced Micro Devices, In c.
Prod uct na mes u sed in this pub lication are for ide ntification purpo se s only an d m ay be tra dem arks of th eir resp ective comp anies.
4 0
EH QZ
WLA X
DVWH
WLWH
DVEH
ELEH
ELAX
C C 1
20 -y ea r d ata re te ntion a t 1 25
— R el iable ope ratio n for the l ife o f the s y s te m
, I
: C hange d the 9 0 s peed option to 45 n s from 50 ns .
: C hang ed the 5 5 s peed optio n to 25 ns fro m 30 ns .
: C han ged the 55 s pe ed op tion to 30 ns from 35 ns.
, t
: C hange d th e 90 spe ed op tion to 4 5 ns fr om 50 ns .
: C hange d the 55 s peed option to 25 ns from 30 ns .
: c hange d th e 55 s pe ed option to 3 0 ns fro m 35 ns .
fatal risks o r da ngers that, unless extremely hig h sa fety is sec ured, could have a serious effec t to the public, and co uld lea d directly to death, persona l
CC 2
G HQZ
, I
C C 3
: C h an ged the 5 5 s p ee d optio n to 1 5 n s
,
the respec tive gov ernment entity
I
C C4
: A d de d N o te 2 “M ax i m u m I
C C
°
C
= V
C Cm ax
will be required for export of those products.
A m 29 F 002 B /A m 29 F 00 2N B
”.
n, the U S Export Administration Regulations or the a pplicable la ws of a ny other c ountry,
to
yo u and/or a ny third pa rty for a ny claims or da mag es a rising in c onnec tion w ith abo ve-
C C
for any use where chanc e of fa ilure is into lerable
D C C h ar a cte rist ic s— C M OS C o m p a tib le
I
s p ec ific ation s a re tes ted w ith V
Revision C (November 12, 1999)
A C C h ar ac ter istics —
O p er at io n s T im in g an d
E r ase Op er a tio n s
D e leted t
h igh .
P h ysic al D im en sio n s
R e pla c ed figu res w ith m or e detai led il lus tration s.
Revision D (November 28, 2000)
G lo b al
A dd ed tabl e of c o nten ts .
O r de r in g In for m atio n
D e leted bur n-in o ption .
T ab le
In N o te
r ang e to A11 .
Revision D + 1 (Novem ber 5. 2004)
O r de r in g In for m atio n an d Valid C o m b in at io n s
A dd ed P b-F ree o ption s
C C 1
, I
C C2
5, C o m m an d D e fin it io n s
4
G HWL
, c ha nge d the low er a dd res s bit o f d on’t c ar e
, I
C C 3
an d c han ge d O E# w av efor m to s ta rt at
,
I
C C 4
: Ad d ed N ote 2 “ M a x im u m I
F ig u r e
F ig u r e 12
11. Pr o g r am
CC
(i.e., submersible repea ter and
= V
. C h ip /S ec to r
C Cm ax
”.
a ny
use
tha t
the
CC

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