ADUC814BRU Analog Devices Inc, ADUC814BRU Datasheet - Page 71

• Manufacturer Part Number: ADUC814BRU
• Description: A/D Converter (A-D) IC
• Manufacturer: Analog Devices Inc
• Series: MicroConverter® ADuC8xxr

Specifications of ADUC814BRU

• Peak Reflow Compatible (260 C): No
• No. Of Bits: 12 Bit
• Leaded Process Compatible: No
• Mounting Type: Surface Mount
• No. Of Inputs: 6
• Features: +3V Or +5V Operation
• Package / Case: 28-TSSOP
• Rohs Status: RoHS non-compliant
• Core Processor: 8052
• Core Size: 8-Bit
• Speed: 16.78MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: POR, PSM, Temp Sensor, WDT
• Number Of I /o: 17
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 640 x 8
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 6x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• For Use With: EVAL-ADUC814QSZ - KIT DEV FOR ADUC814 MICROCONVRTR
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

ORDERING GUIDE
Model
ADuC814ARU
ADuC814ARU-REEL
ADuC814ARU-REEL7
ADuC814BRU
ADuC814BRU-REEL
ADuC814BRU-REEL7
QuickStart Development System Model
EVAL-ADUC814QS
EVAL-ADUC814QSP
1
Only available to order through the web.
1
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
Description
Development System for the ADuC814 MicroConverter
QuickStart PLUS Development System
Thin Shrink Small Outline (TSSOP)
Package Description
Thin Shrink Small Outline (TSSOP)
Thin Shrink Small Outline (TSSOP)
Thin Shrink Small Outline (TSSOP)
Thin Shrink Small Outline (TSSOP)
Thin Shrink Small Outline (TSSOP)
Rev. A | Page 71 of 72
Package Option
RU-28
RU-28
RU-28
RU-28
RU-28
RU-28
ADuC814