ADSP-BF514BBCZ-4F4 Analog Devices Inc, ADSP-BF514BBCZ-4F4 Datasheet - Page 69

• Manufacturer Part Number: ADSP-BF514BBCZ-4F4
• Description: Low-Pwr BF Proc W/flash & Cnsmr Conctvty
• Manufacturer: Analog Devices Inc
• Series: Blackfin®r
• Type: Fixed Pointr

Specifications of ADSP-BF514BBCZ-4F4

• Interface: I²C, PPI, RSI, SPI, SPORT, UART/USART
• Clock Rate: 400MHz
• Non-volatile Memory: FLASH (4Mbit)
• On-chip Ram: 116kB
• Voltage - I/o: 1.8V, 2.5V, 3.3V
• Voltage - Core: 1.30V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 168-LFBGA
• Architecture: Modified Harvard
• Format: Fixed Point
• Clock Freq (max): 400MHz
• Device Input Clock Speed: 400MHz
• Ram Size: 48KB
• Program Memory Size: 1024KB
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Package: 168CSP-BGA
• Numeric And Arithmetic Format: Fixed-Point
• Maximum Speed: 400 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

SURFACE-MOUNT DESIGN
Table 59
standard design recommendations, refer to IPC-7351, Generic
Requirements for Surface Mount Design and Land Pattern
Standard.
Table 59. BGA Data for Use with Surface-Mount Design
Package
168-Ball CSP_BGA
ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F
is provided as an aid to PCB design. For industry
CORNER
A1 BALL
1.70
1.60
1.45
Package Ball Attach Type
Solder Mask Defined
Figure 73. 168-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
DETAIL A
TOP VIEW
12.10
12.00 SQ
11.90
COMPLIANT TO JEDEC STANDARDS MO-275-GGAB-1.
Rev. A | Page 69 of 72 | August 2010
Dimensions shown in millimeters
(BC-168-1)
0.70
SEATING
0.56
BSC SQ
PLANE
10.40
BSC
0.80
Package Solder Mask
Opening
0.35 mm diameter
14
DETAIL A
13 12
BALL DIAMETER
11 10
BOTTOM VIEW
0.50
0.45
0.40
9 8
7 6 5 4
COPLANARITY
0.20
3
1.36
1.26
1.16
2
0.34 NOM
0.29 MIN
1
L
A
B
C
D
E
F
G
H
J
K
M
N
P
Package Ball Pad Size
0.48 mm diameter
A1 BALL
CORNER