ADSP-21262SBBC-150 Analog Devices Inc, ADSP-21262SBBC-150 Datasheet - Page 37

• Manufacturer Part Number: ADSP-21262SBBC-150
• Description: IC,DSP,32-BIT,CMOS,BGA,136PIN,PLASTIC
• Manufacturer: Analog Devices Inc
• Series: SHARC®r
• Type: Fixed/Floating Pointr

Specifications of ADSP-21262SBBC-150

• Interface: DAI, SPI
• Clock Rate: 150MHz
• Non-volatile Memory: ROM (512 kB)
• On-chip Ram: 256kB
• Voltage - I/o: 3.30V
• Voltage - Core: 1.20V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 136-CSPBGA
• Device Core Size: 32/40Bit
• Architecture: Super Harvard
• Format: Floating Point
• Clock Freq (max): 150MHz
• Mips: 150
• Device Input Clock Speed: 150MHz
• Ram Size: 256KB
• Program Memory Size: 512KB
• Operating Supply Voltage (typ): 1.2/3.3V
• Operating Supply Voltage (min): 1.14/3.13V
• Operating Supply Voltage (max): 1.26/3.47V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 136
• Package Type: CSPBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

ENVIRONMENTAL CONDITIONS
The ADSP-2126x processor is rated for performance under T
environmental conditions specified in the
tions on Page
THERMAL CHARACTERISTICS
Table 38
JEDEC standards JESD51-2 and JESD51-6 and the junction-to-
board measurement complies with JESD51-8. The junction-to-
case measurement complies with MIL-STD-883. All measure-
ments use a 2S2P JEDEC test board.
To determine the junction temperature of the device while on
the application PCB, use
where:
T
T
package
is the typical value from
moving air).
P
ADSP-21262 SHARC DSPs (EE-216) for more information.
D
J
CASE
JT
= junction temperature (
= power dissipation. See Estimating Power Dissipation for
T
= junction-to-top (of package) characterization parameter
J
Figure 32. Typical Output Delay or Hold vs. Load Capacitance
= case temperature (
10
–4
–2
=
8
6
4
2
0
and
0
T
CASE
Table 39
14.
y = 0.0488x – 1.5923
+
(at Ambient Temperature)
50
airflow measurements comply with
JT
Table 38
°
°
C) measured at the top center of the
LOAD CAPACITANCE (pF)
P
C)
D
and
100
Table 39
Operating Condi-
150
(
JMT
Rev. F | Page 37 of 44 | July 2009
indicates
200
AMB
Values of
design considerations (
used for a first order approximation of T
where:
T
Values of
design considerations when an external heat sink is required.
Table 38. Thermal Characteristics for 136-Ball BGA
Table 39. Thermal Characteristics for 144-Lead LQFP
Parameter
Parameter
ADSP-21261/ADSP-21262/ADSP-21266
A
JA
JMA
JMA
JC
JA
JMA
JMA
JC
JT
JMT
JMT
JT
JMT
JMT
T
= ambient temperature C
J
=
T
A
JA
JC
+
are provided for package comparison and PCB
are provided for package comparison and PCB
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
JA
P
D
JMA
indicates moving air).
J
by the equation
Typical
31.0
27.3
26.0
6.99
0.16
0.30
0.35
Typical
32.5
28.9
27.8
7.8
0.5
0.8
1.0
JA
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
can be
C/W