ADSP-21160MKB-80 Analog Devices Inc, ADSP-21160MKB-80 Datasheet - Page 45

• Manufacturer Part Number: ADSP-21160MKB-80
• Description: IC,DSP,32-BIT,CMOS,BGA,400PIN,PLASTIC
• Manufacturer: Analog Devices Inc
• Series: SHARC®r
• Type: Floating Pointr

Specifications of ADSP-21160MKB-80

• Rohs Compliant: NO
• Rohs Status: RoHS non-compliant
• Interface: Host Interface, Link Port, Serial Port
• Clock Rate: 80MHz
• Non-volatile Memory: External
• On-chip Ram: 512kB
• Voltage - I/o: 3.30V
• Voltage - Core: 2.50V
• Operating Temperature: 0°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 400-BGA

Figure 31. Equivalent Device Loading for AC
Measurements (Includes All Fixtures)
Figure 32. Voltage Reference Levels for AC
Measurements (Except Output Enable/Disable)
Capacitive Loading
Output delays and holds are based on standard capacitive
loads: 50 pF on all pins (see
specifications given should be derated by a factor of
1.5 ns/50 pF for loads other than the nominal value of
50 pF.
varies with capacitance.
output delays and holds vary with load capacitance. (Note
that this graph or derating does not apply to output disable
delays; see
of
outside the ranges shown.
Figure 33. Typical Output Rise Time (10%–90%,
V
REV. 0
DDEXT
Figure
Figure 33
= Max) vs. Load Capacitance
33,
Output Disable Time on page
Figure
and
34, and
Figure 34
Figure 35
Figure
Figure 35
5,6( 7,0(
show how output rise time
31). The delay and hold
graphically shows how
may not be linear
44.) The graphs
–45–
Figure 34. Typical Output Rise Time (10%–90%,
V
Figure 35. Typical Output Delay or Hold vs. Load
Capacitance (at Max Case Temperature)
Environmental Conditions
The ADSP-21160M is tested for performance over the
commercial temperature range, 0°C to 85°C.
Thermal Characteristics
The ADSP-21160M is packaged in a 400-ball Plastic Ball
Grid Array (PBGA). The ADSP-21160M is specified for a
case temperature (T
specification is not exceeded, a heatsink and/or an air flow
source may be used. Use the center block of ground pins
(PBGA balls: H8–13, J8–13, K8–13, L8–13, M8–13, and
N8–13) to provide thermal pathways to the printed circuit
board’s ground plane. A heatsink should be attached to the
ground plane (as close as possible to the thermal pathways)
with a thermal adhesive.
DDEXT
= Min) vs. Load Capacitance
CASE
). To ensure that the T
ADSP-21160M
CASE
data sheet