PC3SD11YTZCF Sharp Microelectronics, PC3SD11YTZCF Datasheet - Page 11

• Manufacturer Part Number: PC3SD11YTZCF
• Description: Triac & SCR Output Optocouplers 600V Low input drive 3mA Ift
• Manufacturer: Sharp Microelectronics

Specifications of PC3SD11YTZCF

• Isolation Voltage: 5000 Vrms
• Configuration: 1
• Maximum Continuous Output Current: 100 mA
• Maximum Input Current: 50 mA
• Maximum Operating Temperature: + 100 C
• Maximum Reverse Diode Voltage: 6 V
• Maximum Turn-on Time: 100 us
• Minimum Operating Temperature: - 30 C
• Output Type: AC
• Package / Case: PDIP-5
• Typical Input Voltage: 1.2 V
• Zero-crossing Circuit: No
• Output Device: Triac
• Peak Output Voltage (vdrm): 600 V
• Maximum Input Voltage: 1.4 V
• Maximum Output Voltage: 420 VAC
• Minimum Trigger Current: 5 mA (Max)
• No. Of Channels: 1
• Input Current: 20mA
• Output Voltage: 600V
• Opto Case Style: DIP
• No. Of Pins: 6
• Approval Bodies: CSA
• Approval Category: UL Recognised
• External Depth: 7.62mm
• External Length /: RoHS Compliant
• Optocoupler Output Type: Phototriac
• Svhc: No SVHC (15-Dec-2010)
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Flow Soldering :
Hand soldering
Other notices
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
(˚C)
300
200
100
0
0
Terminal : 260˚C peak
( package surface : 250˚C peak)
1
Preheat
150 to 180˚C, 120s or less
2
11
3
Reflow
220˚C or more, 60s or less
4
PC3SD11NTZ Series
(min)
Sheet No.: D2-A07501EN