BLM15AG221PN1D Murata, BLM15AG221PN1D Datasheet - Page 180

• Manufacturer Part Number: BLM15AG221PN1D
• Manufacturer: Murata
• Type: EMI Filterr

Specifications of BLM15AG221PN1D

• Mounting Style: Surface Mount
• Termination: Flat Style
• Operating Temp Range: -55C to 125C
• Current Rating (max): 0.3A
• Product Height (mm): 0.5mm
• Product Depth (mm): 0.5mm
• Product Length (mm): 1mm
• Lead Free Status / RoHS Status: Compliant

6
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
178
3. Standard Soldering Conditions
(1) Soldering Methods
Solder: H60A H63A solder (JIS Z 3238)
(2) Soldering profile
EMIFILr (Soldering and Mounting)
BNX022
oFlow Soldering profile
Use flow and reflow soldering methods only.
Use standard soldering conditions when soldering chip
EMI suppression filters.
In cases where several different parts are soldered, each
having different soldering conditions, use those
conditions requiring the least heat and minimum time.
Continued from the preceding page.
(Eutectic solder, Sn-3.0Ag-0.5Cu solder)
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
*
Series
Except NFE61HT332
BLM (Except BLM02/03/15/18G)
BLA31
NFM3DC/3DP
NFM41C/41P
NFE61H*/61P
DLM2HG
DLP31D/31S
NFW31S
In case of lead-free solder, use Sn-3.0Ag-0.5Cu
solder. Use of Sn-Zn based solder will deteriorate
performance of products.
If using BLA/NFM/DLP/DLM series with Sn-Zn
based solder, please contact Murata in advance.
Series
oUse Sn/Pb=60/40 or Sn-3.0Ag-0.5Cu solder for
oCoat with solder paste to the following thickness:
150-200 m
pattern printing.
12.5
10.2
9.6
7.1
5.3
2.8
2.3
0
PSG
Solder Paste Printing
Temp. (T1)
B
150 C
150 C
T1
Pre-heating
Time. (t1)
60s min.
60s min.
CG
Pre-heating
CG
t1
T3
T2
CB
CG
Temp. (T2)
Heating
250 C
250 C
t2
Heating
Flux:
o Use Rosin-based flux.
o Do not use strong acidic flux (with chlorine content
o Do not use water-soluble flux.
For additional mounting methods, please contact Murata.
Standard Profile
time (s)
converting chlorine content of 0.06 to 0.1wt%.
cleaned completely with no residual flux.
exceeding 0.20wt%)
In case of DLW21/31 series, use Rosin-based flux with
In case of using RA type solder, products should be
Time. (t2)
4 to 6s
4 to 6s
Limit Profile
Standard Profile
2 times
2 times
of flow
Cycle
max.
max.
Temp. (T3)
265 3 C
265 3 C
Adhesive Application
Heating
Continued on the following page.
Limit Profile
Time. (t2)
5s max.
5s max.
2 times
1 times
of flow
Cycle
max.
C31E.pdf
07.8.31