BLM15AG221PN1D Murata, BLM15AG221PN1D Datasheet - Page 178

• Manufacturer Part Number: BLM15AG221PN1D
• Manufacturer: Murata
• Type: EMI Filterr

Specifications of BLM15AG221PN1D

• Mounting Style: Surface Mount
• Termination: Flat Style
• Operating Temp Range: -55C to 125C
• Current Rating (max): 0.3A
• Product Height (mm): 0.5mm
• Product Depth (mm): 0.5mm
• Product Length (mm): 1mm
• Lead Free Status / RoHS Status: Compliant

6
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
176
EMIFILr (Soldering and Mounting)
NFM
NFR
NFL
NFW31S
NFE31P
NFA
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Series
NFM18PS
NFM3DC/3DP
oUse Sn/Pb=60/40 or Sn-3.0Ag-0.5Cu solder for
oCoat with solder paste to the following thickness:
NFM18C/18PC
NFL18ST
oUse Sn/Pb=60/40 or Sn-3.0Ag-0.5Cu solder for
oCoat with solder paste to the following thickness:
oUse Sn/Pb=60/40 or Sn-3.0Ag-0.5Cu solder for
oCoat with solder paste to the following thickness:
pattern printing. Use of Sn-Zn based solder will
deteriorate performance of products. If using NFM
series with Sn-Zn based solder, please contact
Murata in advance.
100-150 m: NFM18/21/3D, NFR, NFL
150-200 m: NFM55P
100-200 m: NFM41
pattern printing.
150-200 m
pattern printing.
100-200 m: NFA31G/31C
100-150 m: NFA18S/21S
1.0
2.5
3.9
1.0
2.2
0.05
0.4
0.3
0.175
0.05
NFA31G/31C
0.8
1.2
2.0
NFA18S
2.6
1.375
1.3
2.0
0.4
NFM41C/41P
NFL18SP
Solder Paste Printing
0.8 pitch
0.225
0.6
1.0
2.0
1.5
3.5
5.5
0.4
0.6
2.2
4.2
0.25
0.5
1.5
0.25
NFA21S
NFM21C/21P
NFR21G/NFL21S
NFM55P
0.5
1.4
0.6
2.6
1.5
4.7
6.7
Apply 0.1mg for NFM41C/41P and
0.06mg for NFM3D of bonding agent at
each chip. Do not cover electrodes.
NFW31S Series
Apply 0.2mg of bonding agent at each chip.
Bonding agent
Bonding agent
Adhesive Application
Continued on the following page.
Coating position of
bonding agent
Coating positon of
bonding agent
(in mm)
C31E.pdf
07.8.31