HSDL-3201#021 Lite-On Electronics, HSDL-3201#021 Datasheet - Page 12

• Manufacturer Part Number: HSDL-3201#021
• Description: Infrared Transceivers IR Transceiver 115.2Kb/s
• Manufacturer: Lite-On Electronics
• Type: TX/RXr

Specifications of HSDL-3201#021

• Wavelength: 875 nm, 880 nm
• Continual Data Transmission: 115.2 Kbit/s
• Transmission Distance: 30 cm
• Radiant Intensity: 9 mW/sr
• Half Intensity Angle Degrees: 30 deg to 60 deg
• Pulse Width: 2.45 us, 1.6 us
• Maximum Rise Time: 120 ns, 600 ns
• Maximum Fall Time: 80 ns, 600 ns
• Led Supply Voltage: 2.7 V to 6 V
• Operating Voltage: 2.7 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 25 C
• Dimensions: 8 mm x 3 mm x 2.5 mm
• Data Rate: 115.2Kbps
• Peak Wavelength: 875/880nm
• Angle Of Half Sensitivity: 60/30°
• Communication Distance: 30
• Package Type: Ultra Small Profile
• Fall Time: 600/25ns
• Rise Time: 600/20ns
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Mounting: Surface Mount
• Pin Count: 8
• Operating Temp Range: -25C to 85C
• Operating Temperature Classification: Commercial
• Lead Free Status / Rohs Status: Compliant

Appendix A: HSDL-3201#021
SMT Assembly Application Note
Solder Pad, Mask, and Metal Stencil
Recommended Metal Solder
Stencil Aperture
It is recommended that only a 0.127
mm (0.005 inches) or a 0.11 mm (0.004
inches) thick stencil be used for solder
paste printing. This is to ensure
adequate printed solder paste volume
and no shorting. See the table below
the drawing for combinations of metal
stencil aperture and metal stencil
thickness that should be used.
Aperture opening for shield pad is 2.7
mm x 1.25 mm as per land pattern.
12
APERTURE
STENCIL
SOLDER
MASK
Stencil Thickness, t (mm)
0.127 mm
0.11 mm
LAND
PATTERN
l
APERTURES AS PER
LAND DIMENSIONS
METAL STENCIL
FOR SOLDER PASTE
PRINTING
PCB
length, l
1.75
2.4
0.05
0.05
Aperture Size (mm)
w
width, w
0.55
0.55
0.05
0.05
t