B6TS-04LT Omron, B6TS-04LT Datasheet - Page 4

• Manufacturer Part Number: B6TS-04LT
• Description: Capacitance Touch Sensors Sensing IC
• Manufacturer: Omron
• Series: -r
• Type: Capacitiver

Specifications of B6TS-04LT

• Sensitivity: -
• Response Time: -
• Interface: SPI
• Channel Inputs: 4 Key
• Voltage - Supply: 3 V ~ 5 V
• Actuator Type: -
• Package / Case: 20-LSSOP (0.173", 4.40mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

3.
[1]
2]
[3]
Temperature conditions for mounting the IC chip
Recommended soldering conditions
When mounting the IC chip at a high temperature using reflow soldering, the melting temperature of the solder
depends on the mounting board and paste adhesive materials. Referring to the mounting temperature profile shown in
Fig. 1, choose the optimum soldering temperature within the profile.
Reflow method (infrared light reflow and air reflow)
[Number of times]
[Temperature]
Wave soldering method (known as flow soldering or dip soldering)
[Number of times]
[Temperature]
Soldering iron (manual soldering)
Solder using a soldering iron for semiconductor devices under the following conditions:
[Iron tip temperature]
[Soldering time]
175±15℃
Up to three times
(Complete the last reflow under storage condition B in Section 1.)
The surface temperature profile of the device is shown in Fig. 1.
Once
The temperature profile is shown in Fig. 2.
(The optimum preheating temperature must be set according to the type of flux.)
No higher than 370°C
No longer than 5 sec/pin
Fig.2 Wave soldering method temperature profile
Fig.1 Reflow method temperature profile
110±30ｓ
10s max.(Primary and secondary flux passing time)
1∼4℃／s
80∼150℃(Package surface temperature)
260℃ max.(Solder temperature)
Time (sec)
Time (sec)
260℃max
255°C or higher, 10 - 16 sec max.
220°C or higher, 60 sec max.