AFCT-711XPDZ Avago Technologies US Inc., AFCT-711XPDZ Datasheet - Page 5

• Manufacturer Part Number: AFCT-711XPDZ
• Description: NORA XFP 2km OC-192 0-70
• Manufacturer: Avago Technologies US Inc.

Specifications of AFCT-711XPDZ

• Data Rate: 10.625Gbps
• Wavelength: 1310nm
• Applications: General Purpose
• Voltage - Supply: 3.135 V ~ 3.465 V
• Connector Type: LC Duplex
• Mounting Type: Panel Mount
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Absolute Maximum Ratings
Recommended Operating Conditions
Transceiver Electrical Characteristics
(T
Notes:
1. Absolute Maximum Ratings are those values beyond which damage to the device may occur if these limits are exceeded for other than a short
2. Between Absolute Maximum Ratings and the Recommended Operating Conditions functional performance is not intended, device reliability
3. The Ambient Operating Temperature limitations are based on the Case Operating Temperature limitations and are subject to the host system
4. Recommended Operating Conditions are those values for which functional performance and device reliability is implied
5. Vcc condition applies to supply voltage at the XFP module
6. Power Supply filtering on host board required as per XFP MSA specification
7. 4.7 kΩ to 10 kΩ resistor pull-up to host_V
8. 4.7 kΩ to 10 kΩ resistor pull-up to host_V
9. 4.7 kΩ to 10 kΩ resistor pull-up to host_V
10. 4.7 kΩ to 10 kΩ resistor pull-up to host_V
5
Parameter
Storage Temperature
(non-operating)
Ambient Operating Temperature
Relative Humidity
Supply Voltage
Low Speed Input Voltage
Parameter
Case Operating Temperature
Supply Voltage
Data Rate
Parameter
Power Supply Noise Rejection
(peak-peak) under 1MHz
Power Supply Noise Rejection
(peak-peak) 1MHz to 10 MHz
Module supply current
Power Dissipation
Low Speed Outputs:
MOD_NR, RX_LOS, MOD_ABS,
INTERRUPT
Low Speed Inputs:
TX_DIS, MOD_DESEL, P_DOWN/RST
C
period of time. See Reliability Data Sheet for specific reliability performance.
is not implied, and damage to the device may occur over an extended period of time.
thermal design.
= -5 °C to +70 °C, V
CC
3 = 3.3 V ± 5%)
[4]
CC
CC
CC
CC
Symbol
T
T
RH
V
V
Symbol
T
V
Symbol
PSNR
PSNR
I
P
V
V
V
V
CC
A
S
C
CC3
IN
CC
DISS
OH
OL
IH
IL
, measured at the host side of connector. I
, measured at the host side of connector. I
, measured at the host side of connector. I
, measured at the host side of connector. I
3
Minimum
Host_V
0.0
2.0
-0.5
Minimum
-40
-40
10
-0.5
Minimum
-5
3.135
9.95
CC
-0.5
Typical
Typical
Typical
425
1410
OH
OL
IL
IH
(max) = 10 µA.
(max) = - 10 µA.
(max) = 2 mA.
(max) = - 2 mA.
Maximum
+85
+85
90
3.6
V
Maximum
+70
3.465
11.3
Maximum
2% of V
3% of V
605 (EOL)
2100 (EOL)
Host_V
0.4
V
0.8
CC
CC
+0.5
3+0.3
CC
CC
CC
+0.3
Unit
°C
°C
%
V
V
Unit
°C
V
Gb/s
Unit
mV
mV
mA
mW
V
V
V
V
Notes
1, 2, 3
1, 2, 3
1
1, 2
1
Notes
3
5
Notes
6
6
7
8
10
9