BSP171P Infineon Technologies, BSP171P Datasheet
BSP171P
Specifications of BSP171P
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BSP171P Summary of contents
Page 1
... Tape and Reel Information L6327 Symbol Conditions =25 ° =70 ° =25 °C D,pulse =-1 = =-1 =- /dt di /dt =-200 A/µs, T =150 °C j,max =25 °C tot stg page 1 BSP171P -60 0.3 -1.9 PG-SOT-223 Marking 171P Value Unit steady state -1.9 A -1.5 -7 kV/µs ±20 V 1.8 W -55 ... 150 °C 55/150/56 2005-11- ...
Page 2
... GS(th) I =-460 µ =- DSS T =25 ° =- =125 ° =- GSS =-4 DS(on) I =-1 =- =-1 |>2 DS(on)max =-1 (one layer, 70 µm thick) copper area for drain page 2 Values min. typ. max 110 - -1 -0 -10 -100 = -10 -100 - 0.3 0.45 - 0.21 0.3 , 1.4 2.7 - BSP171P Unit K/W V µ 2005-11-29 ...
Page 3
... Symbol Conditions C iss oss V =- MHz DS C rss t d(on =-1 d(off =- =1 - plateau oss =25 ° S,pulse =1 =25 ° =- =| /dt =100 A/µ page 3 BSP171P Values Unit min. typ. max. - 365 460 pF - 105 135 - 208 276 - 87 130 - -1.2 -1 - -7.6 - -0.84 -1 120 ns - -125 -190 nC 2005-11-29 ...
Page 4
... DS Rev 2.3 2 Drain current I =f 1.5 1 0.5 0 120 160 4 Max. transient thermal impedance Z =f(t thJA parameter µs 100 µ 100 100 10 [V] page 4 |≥ 120 T [° 0.5 0.2 0.1 0.05 0.02 0.01 single pulse - [s] p BSP171P 160 2005-11-29 ...
Page 5
... Typ. transfer characteristics I =f |>2 DS(on)max parameter °125 Rev 2.3 6 Typ. drain-source on resistance R =f(I DS(on) parameter: V 600 -4 V 500 400 -3.5 V 300 200 -3 V 100 -2 [V] 8 Typ. forward transconductance g =f ° [V] page =25 ° -3 [A] D =25 ° [A] D BSP171P - 2005-11-29 ...
Page 6
... Typ. gate threshold voltage V =f(T GS(th) 3 2.5 2 1.5 1 0.5 0 100 140 180 -60 12 Forward characteristics of reverse diode I =f parameter [V] page =-460 µ max. typ. min. - 100 T [° 150 °C, typ 150 °C, 98% 25 °C, 98 [V] SD BSP171P 140 180 25 °C, typ 1.5 2005-11-29 ...
Page 7
... Drain-source breakdown voltage V =f =-1 mA BR(DSS -60 - [°C] j Rev 2.3 14 Typ. gate charge V =f gate parameter ° °100 6 C °125 100 1000 0 16 Gate charge waveforms s(th (th) 100 140 180 page 7 BSP171P =-1.9 A pulsed D DD 0.5 VBR(DSS) 0.2 VBR(DSS) 0.8 VBR(DSS [nC] gate 2005-11- gate ...
Page 8
... Package Outline SOT-223: Outline Footprint Dimensions in mm Rev 2.3 Packaging Tape page 8 BSP171P 2005-11-29 ...
Page 9
... Life support devices or systems are intended to be implanted in the human body support and/or maintain and sustain and/or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Rev 2.3 page 9 BSP171P 2005-11-29 ...