STM32F103ZGH6 STMicroelectronics, STM32F103ZGH6 Datasheet - Page 41
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STM32F103ZGH6
Manufacturer Part Number
STM32F103ZGH6
Description
MCU 32BIT 1MB FLASH 144LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet
1.STM32F103VGT6.pdf
(120 pages)
Specifications of STM32F103ZGH6
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, I²C, IrDA, LIN, MMC, SPI, UART/USART, USB
Peripherals
DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
112
Program Memory Size
1MB (1M x 8)
Program Memory Type
FLASH
Ram Size
96K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 21x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Processor Series
STM32F101xG
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
80 KB
Interface Type
I2C, SPI, UART
Maximum Clock Frequency
36 MHz
Number Of Programmable I/os
112
Number Of Timers
15
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Operating Temperature Range
- 40 C to + 105 C
Processor To Be Evaluated
STM32F103ZG
Supply Current (max)
28 mA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
497-11115
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM32F103ZGH6
Manufacturer:
STMicroelectronics
Quantity:
135
Company:
Part Number:
STM32F103ZGH6
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
STM32F103ZGH6
Manufacturer:
ST
Quantity:
20 000
STM32F103xF, STM32F103xG
5.3
5.3.1
Table 9.
Operating conditions
General operating conditions
Table 10.
1. When the ADC is used, refer to
2. It is recommended to power V
3. If T
4. In low power dissipation state, T
Symbol
V
between V
characteristics on page
Table 6.2: Thermal characteristics on page
f
f
f
PCLK1
PCLK2
V
DDA
HCLK
V
P
T
T
BAT
DD
Symbol
A
A
D
J
T
is lower, higher P
(1)
STG
T
J
DD
Thermal characteristics
General operating conditions
Internal AHB clock frequency
Internal APB1 clock frequency
Internal APB2 clock frequency
Standard operating voltage
Analog operating voltage
(ADC not used)
Analog operating voltage
(ADC used)
Backup operating voltage
Power dissipation at T
85 °C for suffix 6 or T
105 °C for suffix 7
Ambient temperature for 6
suffix version
Ambient temperature for 7
suffix version
Junction temperature range
and V
DDA
Storage temperature range
Maximum junction temperature
D
Parameter
115).
can be tolerated during power-up and operation.
values are allowed as long as T
DD
A
Table 59: ADC
(3)
and V
can be extended to this range as long as T
Doc ID 16554 Rev 2
A
A
=
=
DDA
Ratings
115).
from the same source. A maximum difference of 300 mV
characteristics.
Must be the same potential
as V
LQFP144
LQFP100
LQFP64
LFBGA144
Maximum power dissipation
Low power dissipation
Maximum power dissipation
Low power dissipation
6 suffix version
7 suffix version
DD
J
(2)
does not exceed T
Conditions
(4)
(4)
J
J
max (see
Electrical characteristics
does not exceed T
–65 to +150
Min
–40
–40
–40
–40
–40
–40
2.4
1.8
Value
150
0
0
0
2
2
Table 6.2: Thermal
Max
666
434
444
500
105
105
125
105
125
3.6
3.6
3.6
3.6
72
36
72
85
J
max (see
Unit
MHz
Unit
mW
41/120
°C
°C
°C
°C
°C
V
V
V