STM32F103ZGH6 STMicroelectronics, STM32F103ZGH6 Datasheet - Page 12
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STM32F103ZGH6
Manufacturer Part Number
STM32F103ZGH6
Description
MCU 32BIT 1MB FLASH 144LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet
1.STM32F103VGT6.pdf
(120 pages)
Specifications of STM32F103ZGH6
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, I²C, IrDA, LIN, MMC, SPI, UART/USART, USB
Peripherals
DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
112
Program Memory Size
1MB (1M x 8)
Program Memory Type
FLASH
Ram Size
96K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 21x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Processor Series
STM32F101xG
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
80 KB
Interface Type
I2C, SPI, UART
Maximum Clock Frequency
36 MHz
Number Of Programmable I/os
112
Number Of Timers
15
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Operating Temperature Range
- 40 C to + 105 C
Processor To Be Evaluated
STM32F103ZG
Supply Current (max)
28 mA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
497-11115
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM32F103ZGH6
Manufacturer:
STMicroelectronics
Quantity:
135
Company:
Part Number:
STM32F103ZGH6
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
STM32F103ZGH6
Manufacturer:
ST
Quantity:
20 000
Description
Figure 1.
1. T
2. AF = alternate function on I/O port pin.
12/120
BKIN, ETR input as AF
4 channels
4 compl.
4
4 compl.
BKIN, ETR input as AF
CK as AF
8 ADINs common
RX,TX, CTS, RTS,
8 ADINs common
5 ADINs on ADC3
2
channels
1
1
SCK,NSS as AF
to the ADC1 & 2
105 °C or 125 °C, respectively.
channels
channel
channel
JTCK/SWCLK
JTMS/SWDAT
to the 3 ADCs
A
MOSI,MISO,
TRACED[0:3]
D[7:0], CMD
CK as AF
TRACECLK
= –40 °C to +85 °C (suffix 6, see
NBL[1:0]
NE[3:0]
A[25:0]
D[15:0]
NWAIT
channels
as AF
channels
NJTRST
NWE
NOE
V
V
CLK
PB[15:0]
PA[15:0]
PD[15:0]
PE[15:0]
PF[15:0]
PC[15:0]
PG[15:0]
as AF
JTDO
as AF
REF–
REF+
NL
as AF
as AF
112 AF
as AF
JTDI
STM32F103xF and STM32F103xG performance line block diagram
SWJTAG
Temp sensor
Cortex-M3 CPU
12bit ADC2
12bit ADC1
12bit ADC3 IF
TPIU
F
@VDDA
max
GPIO port C
GPIO port D
GPIO port G
GPIO port A
GPIO port B
GPIO port E
GPIO port F
TIM10
EXT.IT
WKUP
TIM9
TIM11
USART1
NVIC
SDIO
TIM8
MPU
: 48/72 MHz
TIM1
NVIC
GP DMA1
7 channels
GP DMA2
5 channels
SPI1
FSMC
Trace/Trig
ETM
IF
IF
Table
System
Dbus
APB3
Ib u s
70) or –40 °C to +105 °C (suffix 7, see
AHB2
APB2
Doc ID 16554 Rev 2
96 Kbyte
SRAM
APB1
Reset &
clock
controller
WWDG
SRAM 512B
TIM6
TIM7
PCLK1
PCLK2
PCLK3
HCLK
FCLK
Flash1 512 KB
PLL
Flash2 512 KB
@V DDA
RC HS
RC LS
64 bit
64 bit
Table
Reset
STM32F103xF, STM32F103xG
POR
Int
V DD
70), junction temperature up to
USB 2.0 FS device
@V DDA
Backup interface
IF
IF IF
bxCAN device
AWU
SUPERVISION
RTC
SPI3/I2S3
Standby
interface
SPI2/I2S2
POR / PDR
3.3V TO 1.8V
USART2
USART3
IWDG
12bit DAC1
12bit DAC2
SUPPLY
XTAL 32 kHz
UART4
UART5
TIM12
TIM13
TIM14
VOLT. REG.
TIM2
TIM3
TIM4
TIM5
I2C1
I2C2
POWER
PVD
XTAL OSC
@V DD
4-16 MHz
@V DDA
@V DD
Backup
@VSW
reg
V BAT =1.8V to 3.6V
V DD
OSC_IN
OSC_OUT
OSC32_IN
OSC32_OUT
V SS
NRST
V DDA
V SSA
4 Ch, ETR as AF
4 Ch, ETR as AF
DAC1_OUT as AF
4 Ch, ETR as AF
4 Ch, ETR as AF
1 channel as AF
1 channel as AF
RX,TX as AF
RX,TX as AF
MOSI/SD,MISO,
SCK/CK,NSS/WS,
MCLK as AF
MOSI/SD,MISO,
SCK/CK,NSS/WS,
MCLK as AF
DAC2_OUT as AF
2 channels as AF
RX,TX, CTS, RTS,
CK as AF
RX,TX, CTS, RTS,
CK as AF
SCL,SDA,SMBA
as AF
TAMPER-RTC
(ALARM OUT)
SCL,SDA,SMBA
as AF
USBDM/CAN_RX
USBDP/CAN_TX
=2 t o 3.6V
ai17352