APDS-9300-020 Avago Technologies US Inc., APDS-9300-020 Datasheet - Page 18

• Manufacturer Part Number: APDS-9300-020
• Description: IC SENSOR AMBIENT LIGHT 6CHIPLED
• Manufacturer: Avago Technologies US Inc.
• Type: Chipr

Specifications of APDS-9300-020

• Wavelength: 640nm, 940nm
• Output Type: I²C™
• Package / Case: 6CHIPLED
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 30 C
• Output Current: 20mA
• Sensor Output: Digital
• Supply Voltage Range Dc: 2.4V To 3V
• External Depth: 2.2mm
• External Width: 2.6mm
• Leaded Process Compatible: Yes
• Length/height, External: 0.55mm
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 516-2134-2

Recommended Reflow Profile
The reflow profile is a straight-line representation of a
nominal temperature profile for a convective reflow sol-
der process. The temperature profile is divided into four
process zones, each with different DT/Dtime temperature
change rates or duration. The DT/Dtime rates or duration
are detailed in the above table. The temperatures are
measured at the component to printed circuit board con-
nections.
In process zone P1, the PC board and component pins are
heated to a temperature of 150°C to activate the flux in
the solder paste. The temperature ramp up rate, R1, is lim-
ited to 3°C per second to allow for even heating of both
the PC board and component pins.
Process zone P2 should be of sufficient time duration (100
to 180 seconds) to dry the solder paste. The temperature
is raised to a level just below the liquidus point of the sol-
der.
18
150
120
230
217
180
255
200
80
25
Process Zone
Heat Up
Solder Paste Dry
Solder Reflow
Cool Down
Time maintained above liquidus point , 217°C
Peak Temperature
Time within 5°C of actual Peak Temperature
Time 25°C to Peak Temperature
0
R1
HEAT
P1
UP
50
R2
SOLDER PASTE DRY
100
P2
Symbol
P1, R1
P2, R2
P3, R3
P3, R4
P4, R5
150
Process zone P3 is the solder reflow zone. In zone P3, the
temperature is quickly raised above the liquidus point of
solder to 260°C (500°F) for optimum results. The dwell time
above the liquidus point of solder should be between 60
and 90 seconds. This is to assure proper coalescing of the
solder paste into liquid solder and the formation of good
solder connections. Beyond the recommended dwell time
the intermetallic growth within the solder connections
becomes excessive, resulting in the formation of weak
and unreliable connections. The temperature is then rap-
idly reduced to a point below the solidus temperature of
the solder to allow the solder within the connections to
freeze solid.
Process zone P4 is the cool down after solder freeze. The
cool down rate, R5, from the liquidus point of the solder to
25°C (77°F) should not exceed 6°C per second maximum.
This limitation is necessary to allow the PC board and
component pins to change dimensions evenly, putting
minimal stresses on the component.
It is recommended to perform reflow soldering no more
than twice.
R3
60 sec to 90 sec
Above 217°C
MAX 260°C
200
REFLOW
SOLDER
150°C to 200°C
200°C to 260°C
260°C to 200°C
25°C to 150°C
200°C to 25°C
25°C to 260°C
P3
> 217°C
260°C
DT
-
R4
COOL DOWN
250
P4
R5
Maximum DT/Dtime
100s to 180s
or Duration
60s to 90s
20s to 40s
-6°C/s
-6°C/s
8mins
3°C/s
3°C/s
(SECONDS)
-
t-TIME
300