ADIS16060BCCZ Analog Devices Inc, ADIS16060BCCZ Datasheet - Page 7

• Manufacturer Part Number: ADIS16060BCCZ
• Description: IC GYROSCOPE YAW RATE SPI 16LGA
• Manufacturer: Analog Devices Inc

Specifications of ADIS16060BCCZ

• Range °/s: ±80°/s
• Sensitivity: 0.0122°/sec/LSB
• Typical Bandwidth: 1kHz
• Voltage - Supply: 4.75 V ~ 5.25 V
• Current - Supply: 4.3mA
• Output Type: SPI
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 16-LGA
• No. Of Axes: 1
• Sensor Case Style: LGA
• No. Of Pins: 16
• Supply Voltage Range: 4.75V To 5.25V
• Operating Temperature Range: -40°C To +105°C
• Msl: MSL 1 - Unlimited
• Acceleration Range: 2000g
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: ADIS16060/PCBZ - BOARD EVAL FOR ADIS16060
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
Table 4. Pin Function Descriptions
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
1
NOTES
1. NC = NO CONNECT
2. THIS IS NOT AN ACTUAL “TOP VIEW,” AS THE PINS ARE NOT VISIBLE FROM THE
I = input; O = output; S = power supply.
TOP. THIS IS A LAYOUT VIEW, WHICH REPRESENTS THE PIN CONFIGURATION, IF
THE PACKAGE IS LOOKED THROUGH FROM THE TOP. THIS CONFIGURATION IS
PROVIDED FOR PCB LAYOUT PURPOSES.
DOUT
SCLK
Mnemonic
DIN
SCLK
DOUT
NC
RATE
FILT
V
AIN1
AIN2
GND
GND
GND
GND
V
MSEL2
MSEL1
DIN
CC
CC
NC
16
Figure 4. Pin Configuration
5
“LOOK THROUGH”
Type
I
I
O
O
I
S
I
I
S
S
S
S
S
I
I
ADIS16060
(Not to Scale)
PIN 1
INDICATOR
15
6
VIEW
TOP
1
14
Description
SPI Data Input.
SPI Serial Clock.
SPI Data Output.
No Connect.
Buffered Analog Output. Represents the angular rate signal.
External Capacitor Connection to Control Bandwidth.
Power Supply.
External Analog Input Channel 1.
External Analog Input Channel 2.
Ground.
Ground.
Ground.
Ground.
Power Supply.
SPI, Mode Select 2. Used for data input functions.
SPI, Mode Select 1. Used for data output functions.
7
13
8
GND
GND
GND
AIN2
Rev. 0 | Page 7 of 12
7.373 BSC
2×
5.010 BSC
1.000 BSC
2.5050 BSC
4×
Figure 5. Second-Level Assembly Pad Layout
16×
8×
3.6865 BSC
8×
0.5000 BSC
16×
ADIS16060
0.6700 BSC
12×