DSPIC30F6010AT-30I/PF Microchip Technology, DSPIC30F6010AT-30I/PF Datasheet - Page 178
DSPIC30F6010AT-30I/PF
Manufacturer Part Number
DSPIC30F6010AT-30I/PF
Description
IC,DSP,16-BIT,CMOS,TQFP,80PIN,PLASTIC
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(66 pages)
2.DSPIC30F2011-20IP.pdf
(26 pages)
3.DSPIC30F6011A-30IPT.pdf
(6 pages)
4.DSPIC30F6015-30IPT.pdf
(232 pages)
5.DSPIC30F6015-30IPT.pdf
(14 pages)
6.DSPIC30F6015-30IPT.pdf
(12 pages)
7.DSPIC30F6015-30IPT.pdf
(18 pages)
8.DSPIC30F6010A-30IPF.pdf
(22 pages)
Specifications of DSPIC30F6010AT-30I/PF
Rohs Compliant
YES
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
68
Program Memory Size
144KB (48K x 24)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
80-TQFP, 80-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM300019 - BOARD DEMO DSPICDEM 80L STARTERAC164314 - MODULE SKT FOR PM3 80PFDM300020 - BOARD DEV DSPICDEM MC1 MOTORCTRLAC30F001 - MODULE SOCKET DSPIC30F 80TQFPXLT80PT2 - SOCKET TRANSITION ICE 80TQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F6010AT-30I/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
- DSPIC30F2011-20ISO PDF datasheet
- DSPIC30F2011-20IP PDF datasheet #2
- DSPIC30F6011A-30IPT PDF datasheet #3
- DSPIC30F6015-30IPT PDF datasheet #4
- DSPIC30F6015-30IPT PDF datasheet #5
- DSPIC30F6015-30IPT PDF datasheet #6
- DSPIC30F6015-30IPT PDF datasheet #7
- DSPIC30F6010A-30IPF PDF datasheet #8
- Current page: 178 of 232
- Download datasheet (4Mb)
dsPIC30F6010A/6015
24.1
TABLE 24-1:
TABLE 24-2:
TABLE 24-3:
TABLE 24-4:
DS70150D-page 178
dsPIC30F6010A-30I/dsPIC30F6015-30I
dsPIC30F6010A-20E/dsPIC30F6015-20E
Power Dissipation:
Internal chip power dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 80-pin TQFP (14x14x1mm)
Package Thermal Resistance, 80-pin TQFP (12x12x1mm)
Package Thermal Resistance, 64-pin TQFP (10x10x1mm)
Note 1:
V
V
(in Volts)
(in Volts)
DD
DD
Operating Junction Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Ambient Temperature Range
P
DC Characteristics
4.5-5.5
4.5-5.5
3.0-3.6
3.0-3.6
2.5-3.0
4.5-5.5
4.5-5.5
3.0-3.6
3.0-3.6
2.5-3.0
I
/
INT
O
Junction to ambient thermal resistance, Theta-ja (
Range
Range
=
=
∑
V
(
OPERATING MIPS VS. VOLTAGE FOR dsPIC30F6010A
OPERATING MIPS VS. VOLTAGE FOR dsPIC30F6015
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
D D
{
V
×
D D
(
I
DD
–
V
Characteristic
–
O H
∑
} I
Rating
×
I
O H
Temp Range
Temp Range
OH
-40 to +125
-40 to +125
-40 to +125
-40 to +125
)
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
)
(in °C)
(in °C)
+
∑
(
V
OL
×
I
OL
)
dsPIC30F6010A-30I
dsPIC30F6015-30I
θ
JA
) numbers are achieved by package simulations.
Symbol
Symbol
30
—
20
—
10
30
—
20
—
10
P
DMAX
θ
θ
θ
P
T
T
T
T
JA
JA
JA
A
A
D
J
J
Min
Typ
Max MIPS
Max MIPS
-40
-40
-40
-40
36
39
39
(T
© 2008 Microchip Technology Inc.
P
J
INT
– T
Max
dsPIC30F6010A-20E
Typ
—
—
—
—
—
—
—
dsPIC30F6015-20E
+ P
A
)/
θ
I
/
O
JA
°C/W
°C/W
°C/W
+125
+150
+125
20
15
20
15
—
—
—
—
—
—
Max
Unit
+85
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1
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