DSPIC30F3014-20I/PT Microchip Technology, DSPIC30F3014-20I/PT Datasheet - Page 172

• Manufacturer Part Number: DSPIC30F3014-20I/PT
• Description: IC, DSC, 16BIT, 24KB 40MHZ, 5.5V, TQFP44
• Manufacturer: Microchip Technology
• Series: DsPIC30Fr

Specifications of DSPIC30F3014-20I/PT

• Core Frequency: 40MHz
• Core Supply Voltage: 5.5V
• Embedded Interface Type: I2C, SPI, UART
• No. Of I/o's: 30
• Flash Memory Size: 24KB
• Supply Voltage Range: 2.5V To 5.5V
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 20 MIPS
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 30
• Program Memory Size: 24KB (8K x 24)
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 13x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-TQFP, 44-VQFP
• Package: 44TQFP
• Device Core: dsPIC
• Family Name: dsPIC30
• Maximum Speed: 20 MHz
• Operating Supply Voltage: 3.3|5 V
• Data Bus Width: 16 Bit
• Number Of Programmable I/os: 30
• Interface Type: I2C/SPI/UART
• On-chip Adc: 13-chx12-bit
• Number Of Timers: 3
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC30F006 - MODULE SKT FOR DSPIC30F 44TQFPAC164305 - MODULE SKT FOR PM3 44TQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: DSPIC30F301420IPT

dsPIC30F3014/4013
23.1
TABLE 23-1:
TABLE 23-2:
TABLE 23-3:
DS70138G-page 172
dsPIC30F3014-30I
dsPIC30F4013-30I
dsPIC30F3014-20E
dsPIC30F4013-20E
Power Dissipation:
Internal chip power dissipation:
I/O Pin power dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 40-pin DIP (P)
Package Thermal Resistance, 44-pin TQFP (10x10x1mm)
Package Thermal Resistance, 44-pin QFN
Note 1:
V
DD
4.5-5.5V
4.5-5.5V
3.0-3.6V
3.0-3.6V
2.5-3.0V
Operating Junction Temperature Range
DC Characteristics
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Ambient Temperature Range
P
P
I
INT
/
Junction to ambient thermal resistance, Theta-ja (
O
Range
=
=

V

OPERATING MIPS vs. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS

D D
V

D D

I
–
D D
V
Characteristic
–
O H

 I
Rating

I
O H
-40°C to 125°C
-40°C to 125°C
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
Temp Range
OH


+


V
O L

I
O L

dsPIC30FXXX-30I
JA
) numbers are achieved by package simulations.
Symbol
Symbol
30
15
10
—
—
P
DMAX



P
T
T
T
T
JA
JA
JA
A
A
D
J
J
Min
Typ
Max MIPS
-40
-40
-40
-40
—
—
—
(T
 2010 Microchip Technology Inc.
P
J
INT
– T
Max
39.3
27.8
Typ
47
—
—
—
—
dsPIC30FXXX-20E
+ P
A
)/
I
/
O
JA
°C/W
°C/W
°C/W
+125
+150
+125
—
20
—
10
—
Max
Unit
+85
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1