AIS326DQ STMicroelectronics, AIS326DQ Datasheet - Page 47

• Manufacturer Part Number: AIS326DQ
• Description: IC ACCELEROMETER 3-AXIS 28-QFN
• Manufacturer: STMicroelectronics

Specifications of AIS326DQ

• Axis: X, Y, Z
• Acceleration Range: ±2g, 6g
• Sensitivity: 1024LSB/g, 340LSB/g
• Voltage - Supply: 3 V ~ 3.6 V
• Output Type: Digital
• Bandwidth: 40Hz ~ 2.56kHz Selectable
• Interface: SPI
• Mounting Type: Surface Mount
• Package / Case: 28-QFN
• Sensing Axis: X, Y, Z
• Acceleration: 2 g, 6 g
• Digital Output - Number Of Bits: 12 bit
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 3 V
• Supply Current: 0.67 mA
• Maximum Operating Temperature: + 105 C
• Minimum Operating Temperature: - 40 C
• Digital Output - Bus Interface: SPI
• Mounting Style: SMD/SMT
• Shutdown: Yes
• Operating Supply Voltage (min): 3V
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Temperature (min): -40C
• Operating Temperature (max): 105C
• Operating Temperature Classification: Industrial
• Product Depth (mm): 7mm
• Product Length (mm): 7mm
• Mounting: Surface Mount
• Pin Count: 28
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

AIS326DQ
9.2.1
9.3
PCB design rules
Figure 45. Recommended land and solder mask design for QFPN packages
A = Clearance from PCB land edge to solder mask opening ≤ 0.1 mm to ensure that some
solder mask remains between PCB pads
B = PCB land length = QFPN solder pad length + 0.1 mm
C = PCB land width = QFPN solder pad width + 0.1 mm
D = PCB thermal pad solder mask opening = QFPN thermal pad side + 0.2 mm
Stencil design and solder paste application
The thickness and the pattern of the soldering paste are important for the proper
accelerometer mounting process.
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Stainless steel stencils are recommended for solder paste application
A stencil thickness of 125 - 150 µm (5 - 6 mils) is recommended for screen printing
The final thickness of soldering paste should allow proper cleaning of flux residuals and
clearance between sensor package and PCB
Stencil aperture should have rectangular shape with dimension up to 25 µm (1mil)
smaller than PCB land
The openings of the stencil for the signal pads should be between 50% and 80% of the
PCB pad area
Optionally, for better solder paste release, the aperture walls should be trapezoidal and
the corners rounded
The fine pitch of the IC leads requires accurate alignment of the stencil to the printed
circuit board. The stencil and printed circuit assembly should be aligned to within 25 µm
(1 mil) prior to application of the solder paste.
A
Doc ID 14956 Rev 4
D
B
PACKAGE FOOTPRINT
PCB LAND
SOLDER MASK OPENING
PCB THERMAL PAD NOT TO
BE DESIGNED ON PCB
PCB THERMAL PAD SOLDER
MASK OPENING SUGGESTED
TO INCREASE DEVICE
THERMAL PAD TO PCB
CLEARANCE
C
Soldering information
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