AIS326DQ STMicroelectronics, AIS326DQ Datasheet - Page 46

• Manufacturer Part Number: AIS326DQ
• Description: IC ACCELEROMETER 3-AXIS 28-QFN
• Manufacturer: STMicroelectronics

Specifications of AIS326DQ

• Axis: X, Y, Z
• Acceleration Range: ±2g, 6g
• Sensitivity: 1024LSB/g, 340LSB/g
• Voltage - Supply: 3 V ~ 3.6 V
• Output Type: Digital
• Bandwidth: 40Hz ~ 2.56kHz Selectable
• Interface: SPI
• Mounting Type: Surface Mount
• Package / Case: 28-QFN
• Sensing Axis: X, Y, Z
• Acceleration: 2 g, 6 g
• Digital Output - Number Of Bits: 12 bit
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 3 V
• Supply Current: 0.67 mA
• Maximum Operating Temperature: + 105 C
• Minimum Operating Temperature: - 40 C
• Digital Output - Bus Interface: SPI
• Mounting Style: SMD/SMT
• Shutdown: Yes
• Operating Supply Voltage (min): 3V
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Temperature (min): -40C
• Operating Temperature (max): 105C
• Operating Temperature Classification: Industrial
• Product Depth (mm): 7mm
• Product Length (mm): 7mm
• Mounting: Surface Mount
• Pin Count: 28
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Soldering information
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Soldering information
The QFPN-28 package is compliant with the ECOPACK
It is qualified for soldering heat resistance according to JEDEC J-STD-020C, in MSL3
condition.
Land pattern and soldering recommendations are also available at www.st.com/.
General guidelines about soldering surface mount
accelerometer
As common PCB design and industrial practice when considering accelerometer soldering,
there are always 3 elements to take into consideration:
1.
2.
3.
PCB design guidelines
PCB land and solder masking general recommendations are shown in
Figure 46
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PCB with its own conductive layers (i.e. copper) and other organic materials used for
board protection and dielectric isolation.
ACCELEROMETER to be mounted on the board. Accelerometer senses acceleration,
but it senses also the mechanical stress coming from the board. This stress is
minimized with simple PCB design rules.
SOLDERING PASTE like SnAgCu. This soldering paste can be dispensed on the board
with a screen printing method through a stencil. The pattern of the soldering paste on
the PCB is given by the stencil mask itself.
It is recommended to open solder mask external to PCB land;
It is mandatory, for correct device functionality, that some clearance is ensured to be
present between accelerometer thermal pad and PCB. In order to obtain this clearance
it is recommended to open the PCB thermal pad solder mask;
The area below the sensor (on the same side of the board) must be defined as keep-
out area. It is strongly recommended not to place any structure in top metal layer
underneath the sensor;
Traces connected to pads should be as much symmetric as possible. Symmetry and
balance for pad connection will help component self alignment and will lead to a better
control of solder paste reduction after reflow;
For better performances over temperature it is strongly recommended not to place
large insertion components like buttons or shielding boxes at distance less than 2 mm
from the sensor;
Central die pad and “Pin 1 Indicator” are physically connected to GND. Leave “Pin 1
Indicator” unconnected during soldering.
for specific device size, land count and pitch.
Doc ID 14956 Rev 4
®
, RoHS and “Green” standard.
Figure
45. Refer to
AIS326DQ