ADXL312WACPZ-RL Analog Devices Inc, ADXL312WACPZ-RL Datasheet - Page 31

• Manufacturer Part Number: ADXL312WACPZ-RL
• Description: IC ACCEL SPI/I2C 3AX 32LFCSP
• Manufacturer: Analog Devices Inc

Specifications of ADXL312WACPZ-RL

• Axis: X, Y, Z
• Acceleration Range: ±1.5g, 3g, 6g, 12g
• Sensitivity: 345LSB/g, 172LSB/g, 86LSB/g, 43LSB/g
• Voltage - Supply: 2 V ~ 3.6 V
• Output Type: Digital
• Bandwidth: 6.25 Hz ~ 3200 Hz
• Interface: I²C, SPI
• Mounting Type: Surface Mount
• Package / Case: 32-LFQFN, CSP Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

OUTLINE DIMENSIONS
INDICATOR
SEATING
PLANE
1.55
1.45
1.35
PIN 1
3.60 mm
0.57 mm
Figure 39. 32-Lead Lead Frame Chip Scale Package [LFCSP_LQ]
TOP VIEW
5.10
5.00 SQ
4.90
0.30 mm
COMPLIANT TO JEDEC STANDARDS MO-254-LJJD.
Figure 40. Sample Solder Pad Layout (Land Pattern)
Dimensions shown in millimeters
5 mm × 5 mm Body, Thick Quad
Rev. 0 | Page 31 of 32
0.20 REF
5.34 mm
(CP-32-17)
0.05 MAX
0.02 NOM
0.45
0.40
0.35
COPLANARITY
BSC
0.50
0.05
0.50 mm
17
24
0.30
0.25
0.18
25
16
BOTTOM VIEW
EXPOSED
PAD
0.30 mm
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.30 mm
32
9
8
1
3.70
3.60 SQ
3.50
0.20 MIN
ADXL312