MCZ33905BS3EK Freescale Semiconductor, MCZ33905BS3EK Datasheet - Page 18

• Manufacturer Part Number: MCZ33905BS3EK
• Description: IC SBC CAN HS 3.3V 32SOIC
• Manufacturer: Freescale Semiconductor

Specifications of MCZ33905BS3EK

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Table 3. Maximum Ratings (continued)
damage to the device.
18
33903/4/5
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Notes
THERMAL RATINGS
THERMAL RESISTANCE
ESD Capability
Junction temperature
Ambient temperature
Storage temperature
Thermal resistance junction to ambient
Peak package reflow temperature during reflow
All voltages are referenced to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
5.
6.
7.
8.
AECQ100
Tested per IEC 61000-4-2 (C
additional capacitor on VSUP/1/2 pins
90)
Tested per specific OEM EMC requirements for CAN and LIN with
ESD testing is performed in accordance with the Human Body Model (HBM) (C
(CDM), and Robotic (C
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
This parameter was measured according to
Charge Device Model - JESD22/C101 (C
Device unpowered, CANH and CANL pin without capacitor, versus GND
Device unpowered, LIN, LIN1 and LIN2 pin, versus GND
Device unpowered, VS1/VS2 (100 nF to GND), versus GND
Human Body Model - JESD22/A114 (C
CANH, CANL without bus filter
LIN, LIN1 and LIN2 with and without bus filter
I/O with external components (22 k - 10 nF)
(5)
all other Pins including CANH and CANL
Corner Pins (Pins 1, 16, 17, and 32)
CANH and CANL. LIN1 and LIN2, Pins versus all GND pins
All other Pins (Pins 2-15, 18-31)
Figure 15. PCB with Top and Bottom Layer Dissipation Area (Dual Layer)
ZAP
PCB 100mm x 100mm
ZAP
= 4.0 pF).
Ratings
= 150 pF, R
(8)
(See Typical Applications on page
ZAP
(6),
ZAP
ZAP
(7)
Figure
= 100 pF, R
= 330 Ω)
= 4.0 pF)
15:
ZAP
= 1500 Ω)
Top side, 300 sq. mm
(20mmx15mm)
Bottom side
20mm x 40mm
ZAP
V
V
V
V
V
V
V
V
V
V
Symbol
T
ESD1-1
ESD1-2
ESD2-1
ESD2-2
ESD3-1
ESD3-2
ESD3-3
ESD4-1
ESD4-2
ESD4-3
R
T
PPRT
= 100 pF, R
T
T
θJA
ST
A
J
Bottom view
Analog Integrated Circuit Device Data
ZAP
= 1500 Ω), the Charge Device Model
-40 to 125
-50 to 150
±15000
±15000
±15000
±12000
±8000
±2000
±9000
±7000
Value
Note 7
±750
±500
50
150
(8)
Freescale Semiconductor
°C/W
Unit
°C
°C
°C
°C
V