STM8L101F2P6TR STMicroelectronics, STM8L101F2P6TR Datasheet - Page 79

• Manufacturer Part Number: STM8L101F2P6TR
• Description: IC MCU 8BIT 4KB FLASH 20TSSOP
• Manufacturer: STMicroelectronics
• Series: STM8L EnergyLiter

Specifications of STM8L101F2P6TR

• Featured Product: STM32 Cortex-M3 Companion Products
• Core Processor: STM8
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Infrared, POR, PWM, WDT
• Number Of I /o: 18
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• Ram Size: 1.5K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 3.6 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Core: STM8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Details

STM8L101xx
Table 44.
29-Nov-2009
18-Jun-2010
Date
Document revision history (continued)
Revision
8
9
Modified status of the document (datasheet instead of preliminary
data)
Replaced WFQFPN32 with UFQFPN32 and WFQFPN28 with
UFQFPN28.
Modified title of the reference manual mentioned in
Description on page 7
Added references to “low-density” in
page
map on page 23
Modified
Table 7: General hardware register map on page
reserved areas and IR block replaced with IRTIM block
Modified t
power-down on page 41
Modified
Modified
Modified
Table 38: Thermal characteristics on page 65
Modified
Modified
Modified one reserved area (0x00 5055 to 0x00 509F) in
General hardware register map on page 25
ModifiedTable 4: STM8L101xx pin description on page
note 2 and removed “wpu” for PC0 and PC1
Removed one note to
page 46
Modified first paragraph in
Modified OPT3 description in
page 34
Added note 5 to
page 42
Modified V
page 63
Modified
diagram 1) on page 61
Modified COMP_REF availability information in
STM8L101xx ordering information scheme on page 73
Modified
Doc ID 15275 Rev 11
7,
Section 3.5: Memory on page 11
Figure 8: Memory map on page 23
Table 23: LSI oscillator characteristics on page 47
Table 25: Flash program memory on page 49
Table 16: General operating conditions on page 40
Section 10: Package characteristics on page 66
Introduction
Figure 36: Typical application with I2C bus and timing
Section 12.2: Software tools on page 75
TEMP
ESD(CDM)
in
Table 18: Total current consumption in Run mode on
Table 17: Operating conditions at power-up /
in
and
Table 22: HSI oscillator characteristics on
Table 36: ESD absolute maximum ratings on
Description
Section : NRST pin on page 55
Changes
Table 11: Option byte description on
Section 2: Description on
and in
(unique ID are added)
Figure 47:
Figure 8: Memory
25: Modified
Revision history
Section 2:
(t
20: modified
PROG
Table 7:
and
)
79/81