PCF8564ACX9/B/1,02 NXP Semiconductors, PCF8564ACX9/B/1,02 Datasheet - Page 39

• Manufacturer Part Number: PCF8564ACX9/B/1,02
• Description: IC RTC/CALENDAR
• Manufacturer: NXP Semiconductors
• Type: Clock/Calendar/Alarmr

Specifications of PCF8564ACX9/B/1,02

• Time Format: HH:MM:SS (24 hr)
• Date Format: YY-MM-DD-dd
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 1 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: Die
• Function: Serial Clock, Alarm, Calendar, Timer, Timer Interrupt
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1 V
• Mounting Style: SMD/SMT
• Rtc Bus Interface: I2C
• Supply Current: 1700 nA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Memory Size: -
• Lead Free Status / Rohs Status: Supplier Unconfirmed
• Other names: 568-6424-2; PCF8564ACX9/B/1,02

NXP Semiconductors
PCF8564A
Product data sheet
19.3.1 Stand off
19.3.2 Quality of solder joint
19.3.3 Rework
For further information on temperature profiles, refer to application note AN10365
“Surface mount reflow soldering description”.
The stand off between the substrate and the chip is determined by:
The higher the stand off, the better the stresses are released due to TEC (Thermal
Expansion Coefficient) differences between substrate and chip.
A flip-chip joint is considered to be a good joint when the entire solder land has been
wetted by the solder from the bump. The surface of the joint should be smooth and the
shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps
after reflow can occur during the reflow process in bumps with high ratio of bump diameter
to bump height, i.e. low bumps with large diameter. No failures have been found to be
related to these voids. Solder joint inspection after reflow can be done with X-ray to
monitor defects such as bridging, open circuits and voids.
In general, rework is not recommended. By rework we mean the process of removing the
chip from the substrate and replacing it with a new chip. If a chip is removed from the
substrate, most solder balls of the chip will be damaged. In that case it is recommended
not to re-use the chip again.
Fig 35. Temperature profiles for large and small components
•
•
•
The amount of printed solder on the substrate
The size of the solder land on the substrate
The bump height on the chip
temperature
MSL: Moisture Sensitivity Level
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 30 September 2010
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
Real time clock and calendar
temperature
peak
PCF8564A
© NXP B.V. 2010. All rights reserved.
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