PMN8118UWP Ericsson Power Modules, PMN8118UWP Datasheet - Page 46

• Manufacturer Part Number: PMN8118UWP
• Description: DC/DC Converters & Regulators 0.7-3.6V 30A Non-Iso Input 5.5-14V 108W
• Manufacturer: Ericsson Power Modules
• Series: PMNr

Specifications of PMN8118UWP

• Output Power: 108 W
• Input Voltage Range: 5.5 V to 14 V
• Number Of Outputs: 1
• Output Voltage (channel 1): 0.7 V to 3.6 V
• Output Current (channel 1): 30 A
• Output Type: POLA Non-Isolated Regulator
• Product: Non-Isolated / POL
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

E
Soldering Information - Surface Mounting
The surface mount version of the product is intended for
convection or vapor phase reflow SnPb or Pb-free
processes. To achieve a good and reliable soldering result,
make sure to follow the recommendations from the solder
paste supplier, to use state-of-the-art reflow equipment and
reflow profiling techniques as well as the following
guidelines.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between the
product and the host board. The cleaning residues may
affect long time reliability and isolation voltage.
Minimum Pin Temperature Recommendations
Pin number 5 is chosen as reference location for the
minimum pin temperature recommendations since this will
likely be the coolest solder joint during the reflow process.
SnPb solder processes
For SnPb solder processes, a pin temperature (T
excess of the solder melting temperature, (T
Sn63/Pb37) for more than 30 seconds, and a peak
temperature of +210°C is recommended to ensure a reliable
solder joint.
Lead-free (Pb-free) solder processes
For Pb-free solder processes, a pin temperature (T
excess of the solder melting temperature (T
Prepared (also subject responsible if other)
EPANHON
Approved
SEC/D (Julia You)
PMN 8000 series PoL Regulator
Input 5.5 - 14 V, Output up to 30 A / 108 W
Pin 2 for measurement of maximum
peak product reflow temperature, T
Pin 5 for measurement of minimum
solder joint temperature, T
P
PIN
L
L
, +217 to
, +183°C for
Checked
See §1
PIN
PIN
) in
) in
Ericsson Internal
PROD. SPEC. MECH.
No.
5/1301-BMR 656 Uen
Date
2007-06-25
+221°C for Sn/Ag/Cu solder alloys) for more than 30
seconds, and a peak temperature of +235°C on all solder
joints is recommended to ensure a reliable solder joint.
Peak Product Temperature Requirements
Pin 2 is chosen as reference location for the maximum
(peak) allowed product temperature (T
be the warmest part of the product during the reflow
process.
To avoid damage or performance degradation of the
product, the reflow profile should be optimized to avoid
excessive heating. A sufficiently extended preheat time is
recommended to ensure an even temperature across the
host PCB, for both small and large devices. To reduce the
risk of excessive heating is also recommended to reduce the
time in the reflow zone as much as possible.
SnPb solder processes
For SnPb solder processes, the product is qualified for MSL
1 according to IPC/JEDEC standard J-STD-020C.
During reflow, T
Lead-free (Pb-free) solder processes
For Pb-free solder processes, the product is qualified for
MSL 3 according to IPC/JEDEC standard J-STD-020C.
During reflow, T
P
P
must not exceed +225°C at any time.
must not exceed +260°C at any time.
Technical Specification
EN/LZT 146 387 R1B December 2009
© Ericsson AB
Rev
B
Reference
P
) since this will likely
1 (5)
46