LFXP20C-3FN256C Lattice, LFXP20C-3FN256C Datasheet - Page 381
![FPGA - Field Programmable Gate Array 19.7K LUTS 188 I/O](/photos/16/15/161505/landingpagelatticexp2_sml.jpg)
LFXP20C-3FN256C
Manufacturer Part Number
LFXP20C-3FN256C
Description
FPGA - Field Programmable Gate Array 19.7K LUTS 188 I/O
Manufacturer
Lattice
Specifications of LFXP20C-3FN256C
Number Of Programmable I/os
188
Data Ram Size
405504
Supply Voltage (max)
3.465 V
Maximum Operating Temperature
+ 90 C
Minimum Operating Temperature
0 C
Mounting Style
SMD/SMT
Supply Voltage (min)
1.71 V
Package / Case
FPBGA-256
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LFXP20C-3FN256C
Manufacturer:
Lattice
Quantity:
135
Company:
Part Number:
LFXP20C-3FN256C
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
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PCB Layout Recommendations
Lattice Semiconductor
for BGA Packages
100-ball csBGA BGA Breakout and Routing Examples
These examples place a MachXO PLD in a 8x8 mm, 0.5 mm pitch, 100-ball csBGA package (LXMXO640-
M100/MN100) into two fabrication scenarios. One for a 6-layer stack up with maximum I/O utilization and a 4-layer
with about 15% fewer I/Os. The 4-layer (Example #2) design makes maximum use of via and trace geometry to
reduce layer count and ease fabrication while still maintaining high I/O usage.
Figure 14-4. CAM Artwork Screen Shots, Example #1, 100-ball csBGA
Layer 1 Primary
Layer 2 GND
Layer 3 Power
Layer 4 Secondary
14-6
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