MCIMX253CVM4 Freescale Semiconductor, MCIMX253CVM4 Datasheet - Page 99

• Manufacturer Part Number: MCIMX253CVM4
• Description: IC MPU I.MX25 IND 400MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: i.MX25r

Specifications of MCIMX253CVM4

• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 400MHz
• Connectivity: 1-Wire, EBI/EMI, Ethernet, I²C, MMC, SmartCard, SPI, SSI, UART/USART, USB OTG
• Peripherals: DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 128
• Program Memory Type: External Program Memory
• Ram Size: 144K x 8
• Voltage - Supply (vcc/vdd): 1.15 V ~ 1.52 V
• Data Converters: A/D 3x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 400-LFBGA
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Compliant

SIMx_DATAy_RX_TX
Table 76
3.7.14.2
Figure 71
requirements for parameters (SI7–SI10) shown in the figure.
The power-down sequence for the SIM interface is as follows:
Each of the above steps requires one CKIL period (usually 32 kHz). Power-down may be initiated by a
SIM card removal detection; or it may be launched by the processor.
Freescale Semiconductor
SIMx_SVENy
SIMx_RSTy
SIMx_CLKy
•
•
•
•
•
SIMx_SIMPDy port detects the removal of the SIM Card
SIMx_RSTy is negated
SIMx_CLKy is negated
SIMx_DATAy_RX_TX is negated
SIMx_SVENy is negated
defines the general timing requirements for the SIM interface.
Ref No.
shows the SIM interface power-down AC timing diagram.
1
2
3
SIM Power-Down Sequence
Table 76. Timing Specifications, Active-Low-Reset SIM Card Reset Sequence
T0
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 8
1
Figure 70. Active-Low-Reset SIM Card Reset Sequence
40,000
Min.
400
3
—
T1
40,000
Max.
200
—
2
Table 77
3
shows the timing
RESPONSE
clk cycles
clk cycles
clk cycles
Unit
99