MCIMX253CVM4 Freescale Semiconductor, MCIMX253CVM4 Datasheet - Page 50

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MCIMX253CVM4

Manufacturer Part Number
MCIMX253CVM4
Description
IC MPU I.MX25 IND 400MAPBGA
Manufacturer
Freescale Semiconductor
Series
i.MX25r
Datasheets

Specifications of MCIMX253CVM4

Core Processor
ARM9
Core Size
32-Bit
Speed
400MHz
Connectivity
1-Wire, EBI/EMI, Ethernet, I²C, MMC, SmartCard, SPI, SSI, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
128
Program Memory Type
External Program Memory
Ram Size
144K x 8
Voltage - Supply (vcc/vdd)
1.15 V ~ 1.52 V
Data Converters
A/D 3x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
400-LFBGA
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCIMX253CVM4
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Figure 17
Timing parameters for UDMA in-burst are listed in
1
Make t
50
Parameter
There is a special timing requirement in the ATA host that requires the internal DIOW to go only high three clocks after the last
active edge on the DSTROBE signal. The equation given on this line tries to capture this constraint.
tdzfs
tzah
ATA
tack
tenv
tcyc
tcvh
tmli
tdh
tds
trp
on
and t
shows timing for device-terminated UDMA in-transfer.
off
big enough to avoid bus contention.
Parameter
Spec.
tmli1
tdzfs
tdh1
tack
tenv
tds1
tzah
tcvh
tx1
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 8
tc1
ton
toff
trp
DATA READ
DATA WRITE
1
DMARQ
DMACK
DIOW
IORDY
ADDR
DIOR
buffer_en
Figure 17. Timing for Device-Terminated UDMA Transfer
tack(min.) = (time_ack × T) – (tskew1 + tskew2)
tenv(min.) = (time_env × T) – (tskew1 + tskew2)
tenv(max.) = (time_env × T) + (tskew1 + tskew2)
tds – (tskew3) – ti_ds > 0
tdh – (tskew3) –ti_dh > 0
(tcyc – tskew) > T
trp(min.) = time_rp × T – (tskew1 + tskew2 + tskew6)
(time_rp × T) – (tco + tsu + 3T + 2 × tbuf + 2 × tcable2) > trfs (drive)
tmli1(min.) = (time_mlix + 0.4) × T
tzah(min.) = (time_zah + 0.4) × T
tdzfs = (time_dzfs × T) – (tskew1 + tskew2)
tcvh = (time_cvh × T) – (tskew1 + tskew2)
ton = time_on × T – tskew1
toff = time_off × T – tskew1
Table 39. Timing Parameters for UDMA In-Burst
tds
tc1
tdh
tc1
tss1
Table
Value
tli5
39.
tzah
tzah
tmli
tmli
ton tdzfs tcvh
tack
toff
Freescale Semiconductor
Required Conditions
should be low enough
tskew3, ti_ds, ti_dh
T big enough
time_mlix
time_dzfs
time_ack
time_env
time_zah
time_cvh
time_rp
time_rp

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