MCIMX253CVM4 Freescale Semiconductor, MCIMX253CVM4 Datasheet - Page 84

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MCIMX253CVM4

Manufacturer Part Number
MCIMX253CVM4
Description
IC MPU I.MX25 IND 400MAPBGA
Manufacturer
Freescale Semiconductor
Series
i.MX25r
Datasheets

Specifications of MCIMX253CVM4

Core Processor
ARM9
Core Size
32-Bit
Speed
400MHz
Connectivity
1-Wire, EBI/EMI, Ethernet, I²C, MMC, SmartCard, SPI, SSI, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
128
Program Memory Type
External Program Memory
Ram Size
144K x 8
Voltage - Supply (vcc/vdd)
1.15 V ~ 1.52 V
Data Converters
A/D 3x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
400-LFBGA
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCIMX253CVM4
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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3.7.8
Figure 54
figure. The following definitions apply to values and signals described in
84
No.
86
87
88
89
90
91
92
93
94
95
96
97
V
In the “Characteristics” column, bl = bit length, wl = word length, wr = word length relative
In the “Expression” column, T
For the internal clock, the external clock cycle is defined by Icyc and the ESAI control register.
The word-relative frame sync signal waveform relative to the clock operates in the same manner as the bit-length frame sync
signal waveform, but spreads starting from one serial clock before the first bit clock (same as the bit length frame sync signal),
until the second-to-last bit-clock of the first word in the frame.
Periodically sampled and not 100% tested.
CORE_VDD
SCKT rising edge to data out valid
SCKT rising edge to data out high
impedance
SCKT rising edge to transmitter #0 drive
enable negation
FST input (bl, wr) setup time before SCKT
falling edge
FST input (wl) setup time before SCKT falling
edge
FST input hold time after SCKT falling edge
FST input (wl) to data out enable from high
impedance
FST input (wl) to transmitter #0 drive enable
assertion
Flag output valid after SCKT rising edge
HCKR/HCKT clock cycle
HCKT input rising edge to SCKT output
HCKR input rising edge to SCKR output
LS: low-speed mode. Low-speed card can tolerate clocks up to 400 kHz
FS: full-speed mode. Full-speed MMC card’s clock can reach 20 MHz; full speed SD/SDIO card
clock can reach 25 MHz
HS: high-speed mode. High-speed MMC card’s clock can reach 52 MHz; SD/SDIO card clock can
reach 50 MHz
shows eSDHCv2 timing, and
Enhanced Secured Digital Host Controller (eSDHCv2) Timing
= 1.00 ± 0.10 V; T
6
5
Characteristics
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 8
6
Table 60. ESAI General Timing Requirements (continued)
C
J
= –40 °C to 125 °C, C
= 7.5 ns.
1 2
Table 61
Symbol
L
= 50 pF
describes the timing parameters (SD1–SD8) used in the
Expression
2 x T
C
3
Min.
18.0
18.0
2.0
2.0
4.0
5.0
15
Table
Max.
18.0
13.0
21.0
16.0
14.0
21.0
14.0
14.0
18.0
18.0
9.0
9.0
61:
Freescale Semiconductor
Condition
x ck
x ck
x ck
x ck
x ck
x ck
x ck
i ck
i ck
i ck
i ck
i ck
i ck
i ck
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns

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