PK60X256VMD100 Freescale Semiconductor, PK60X256VMD100 Datasheet - Page 31

• Manufacturer Part Number: PK60X256VMD100
• Description: IC ARM CORTEX MCU 256K 144-MAP
• Manufacturer: Freescale Semiconductor
• Series: Kinetisr

Specifications of PK60X256VMD100

• Core Processor: ARM Cortex-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, IrDA, SDHC, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I²S, LVD, POR, PWM, WDT
• Number Of I /o: 100
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 33x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 144-LBGA
• Processor Series: Kinetis
• Core: ARM Cortex M4
• Data Ram Size: 64 KB
• Interface Type: UART, SPI, I2C, I2S, CAN
• Maximum Clock Frequency: 100 MHz
• Number Of Programmable I/os: 100
• Operating Supply Voltage: 1.71 V to 3.6 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

5. These typical values listed are with the slow internal reference clock (FEI) using factory trim and DMX32=1.
6. The resulting clock frequency must not exceed the maximum specified clock frequency of the device.
7. This specification was obtained at TBD frequency.
8. This specification applies to any time the FLL reference source or reference divider is changed, trim value is changed,
9. Excludes any oscillator currents that are also consuming power while PLL is in operation.
10. This specification was obtained using a Freescale developed PCB. PLL jitter is dependent on the noise characteristics of
11. This specification applies to any time the PLL VCO divider or reference divider is changed, or changing from PLL disabled
6.3.2 Oscillator electrical specifications
This section provides the electrical characteristics of the module.
6.3.2.1 Oscillator DC electrical specifications
Freescale Semiconductor, Inc.
Symbol
I
I
DDOSC
DDOSC
DMX32 bit is changed, DRS bits are changed, or changing from FLL disabled (BLPE, BLPI) to FLL enabled (FEI, FEE,
FBE, FBI). If a crystal/resonator is being used as the reference, this specification assumes it is already running.
each PCB and results will vary.
(BLPE, BLPI) to PLL enabled (PBE, PEE). If a crystal/resonator is being used as the reference, this specification assumes
it is already running.
V
C
C
DD
x
y
Supply voltage
Supply current — low-power mode (HGO=0)
Supply current — high gain mode (HGO=1)
EXTAL load capacitance
XTAL load capacitance
Description
• 32 kHz
• 4 MHz
• 8 MHz (only RANGE=01)
• 16 MHz
• 24 MHz
• 32 MHz
• 32 kHz
• 4 MHz
• 8 MHz (only RANGE=01)
• 16 MHz
• 24 MHz
• 32 MHz
Table 16. Oscillator DC electrical specifications
K60 Sub-Family Data Sheet Data Sheet, Rev. 5, 5/2011.
Table continues on the next page...
Preliminary
1.71
Min.
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Peripheral operating requirements and behaviors
Typ.
500
200
300
950
400
500
1.2
1.5
2.5
25
—
—
—
3
4
Max.
3.6
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Unit
mA
mA
mA
mA
mA
μA
μA
μA
μA
μA
μA
nA
V
Notes
2,
2,
1
1
3
3
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