HSP061-4NY8 STMicroelectronics, HSP061-4NY8 Datasheet - Page 8

• Manufacturer Part Number: HSP061-4NY8
• Description: IC ESD PROTECT 4LINE HS 8-UQFN
• Manufacturer: STMicroelectronics

Specifications of HSP061-4NY8

• Voltage - Reverse Standoff (typ): 3V
• Voltage - Breakdown: 6V
• Polarization: 4 Channel Array - Bidirectional
• Mounting Type: Surface Mount
• Package / Case: *
• Polarity: Unidirectional
• Channels: 4 Channels
• Clamping Voltage: 18 V
• Breakdown Voltage: 6 V
• Termination Style: SMD/SMT
• Peak Surge Current: 3 A
• Capacitance: 0.6 pF
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Dimensions: 1 mm W x 2 mm L x 0.5 mm H
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power (watts): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-10895-2

Recommendation on PCB assembly
4.3
4.4
Note:
8/10
PCB design
1.
2.
Figure 13. Printed circuit board layout recommendations
Reflow profile
Figure 14. ST ECOPACK
Minimize air convection currents in the reflow oven to avoid component movement.
To control the solder paste amount, the closed via is recommended instead of open
vias.
The position of tracks and open vias in the solder area should be well balanced. The
symmetrical layout is recommended, in case any tilt phenomena caused by
asymmetrical solder paste amount due to the solder flow away.
Via to
GND
Temperature (°C)
Temperature (°C)
260°C max
260°C max
255°C
255°C
400 µm
125 °C
125 °C
220°C
220°C
180°C
180°C
0
0
0
0
3°C/s max
3°C/s max
1
1
®
recommended soldering reflow profile for PCB mounting
Footprint pad
Doc ID 17414 Rev 2
90 to 150 sec
90 to 150 sec
2
2
1
3
2
4
5
3
3
4
4
90 sec max
90 sec max
8
7
6
10-30 sec
10-30 sec
5
5
PCB tracks
2°C/s recommended
6
6
6°C/s max
2°C/s recommended
6°C/s max
Time (min)
Time (min)
7
7
HSP061-4NY8
Via to
GND