HSP061-4NY8 STMicroelectronics, HSP061-4NY8 Datasheet - Page 7

• Manufacturer Part Number: HSP061-4NY8
• Description: IC ESD PROTECT 4LINE HS 8-UQFN
• Manufacturer: STMicroelectronics

Specifications of HSP061-4NY8

• Voltage - Reverse Standoff (typ): 3V
• Voltage - Breakdown: 6V
• Polarization: 4 Channel Array - Bidirectional
• Mounting Type: Surface Mount
• Package / Case: *
• Polarity: Unidirectional
• Channels: 4 Channels
• Clamping Voltage: 18 V
• Breakdown Voltage: 6 V
• Termination Style: SMD/SMT
• Peak Surge Current: 3 A
• Capacitance: 0.6 pF
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Dimensions: 1 mm W x 2 mm L x 0.5 mm H
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power (watts): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-10895-2

HSP061-4NY8
4
4.1
4.2
Recommendation on PCB assembly
Figure 12. Recommended stencil window position
Solder paste
1.
2.
3.
4.
Placement
1.
2.
3.
4.
5.
6.
Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004.
“No clean” solder paste recommended.
Offers a high tack force to resist component displacement during PCB movement.
Use solder paste with fine particles: powder particle size 20-45 µm.
Manual positioning is not recommended.
It is recommended to use the lead recognition capabilities of the placement system, not
the outline centering.
Standard tolerance of ± 0.05 mm is recommended.
3.5 N placement force is recommended. Too much placement force can lead to
squeezed out solder paste and cause solder joints to short. Too low placement force
can lead to insufficient contact between package and solder paste that could cause
open solder joints or badly centered packages.
To improve the package placement accuracy, a bottom side optical control should be
performed with a high resolution tool.
For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is
recommended during solder paste printing, pick and place and reflow soldering by
using optimized tools.
7 µm
7 µm
186 µm
186 µm
200 µm
200 µm
7 µm
7 µm
Doc ID 17414 Rev 2
13 µm
13 µm
374 µm
374 µm
400 µm
400 µm
13 µm
13 µm
Recommendation on PCB assembly
7 µm
7 µm
Thickness:
186 µm
186 µm
200 µm
200 µm
Footprint
Copper
100 µm
7 µm
7 µm
Stencil window
Footprint
7/10