HSP061-4NY8 STMicroelectronics, HSP061-4NY8 Datasheet
HSP061-4NY8
Specifications of HSP061-4NY8
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HSP061-4NY8 Summary of contents
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... GND 4 I I/O 4 Description The HSP061-4NY8 is a 4-channel ESD array with a rail to rail architecture designed specifically for the protection of high speed differential lines. The ultra-low variation of the capacitance ensures very low influence on signal-skew. The large bandwidth and the low reflection make it compatible with 5 Gbps. The device is packaged in µ ...
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... Test conditions IEC 61000-4- contact ( A), PP measured MHz, I OSC MHz, I OSC -3dB ( 200 ps ( 100 Ω Diff Doc ID 17414 Rev 2 HSP061-4NY8 Value Unit -40 to +150 °C -65 to +150 °C 260 °C Min. Typ. Max. Unit 6 V 100 0.6 0.8 pF 0.03 0. GHz Ω 85 ...
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... HSP061-4NY8 Figure 2. Leakage current versus junction temperature (typical values) 10.00 I (nA) R 1.00 0.10 0. Figure 4. Differential impedance (Z Z 0Diff = 100 Ω 1. HDMI specification conditions. This information can be provided for other applications. Please contact your local ST office. Figure 6. ESD response to IEC 61000-4-2 (+8 kV contact discharge) Figure 3 ...
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... Ordering information scheme 2 Ordering information scheme Figure 8. Ordering information scheme 4/10 High speed line protection Breakdown Voltage Version Number of lines Package µQFN-8L Doc ID 17414 Rev 2 HSP061-4NY8 HSP NY8 ...
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... HSP061-4NY8 3 Package information ● Epoxy meets UL94, V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ECOPACK trademark. Table 3. ...
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... Package information Figure 11. µQFN-8L tape and reel specification Dot identifying Pin A1 location 0.22 0.63 All dimensions are typical values in mm 6/10 2.0 4.0 1.17 4.0 User direction of unreeling Doc ID 17414 Rev 2 HSP061-4NY8 Ø 1.55 ...
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... HSP061-4NY8 4 Recommendation on PCB assembly Figure 12. Recommended stencil window position 7 µm 7 µm 4.1 Solder paste 1. Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste recommended. 3. Offers a high tack force to resist component displacement during PCB movement. 4. Use solder paste with fine particles: powder particle size 20-45 µm. ...
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... Minimize air convection currents in the reflow oven to avoid component movement. 8/ Footprint pad ® recommended soldering reflow profile for PCB mounting 3°C/s max 3°C/s max 150 sec 90 to 150 sec Doc ID 17414 Rev 2 HSP061-4NY8 8 Via to 7 GND 6 PCB tracks 2°C/s recommended 2°C/s recommended 6°C/s max 6°C/s max Time (min) Time (min) ...
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... HSP061-4NY8 5 Ordering information Table 4. Ordering information Order code HSP061-4YN8 6 Revision history Table 5. Document revision history Date 20-Apr-2010 15-Oct-2010 Marking Package H4N µQFN Revision 1 Initial release. Updated values for ΔC 2 Updated package name. Doc ID 17414 Rev 2 Ordering information Weight Base qty Delivery mode 9 ...
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... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 10/10 Please Read Carefully: © 2010 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com Doc ID 17414 Rev 2 HSP061-4NY8 ...