GP1S196HCZSF Sharp Microelectronics, GP1S196HCZSF Datasheet - Page 8

• Manufacturer Part Number: GP1S196HCZSF
• Description: SENSOR OPTO SLOT 1.1MM TRANS SMD
• Manufacturer: Sharp Microelectronics
• Type: Unamplifiedr

Specifications of GP1S196HCZSF

• Sensing Distance: 0.043" (1.1mm)
• Sensing Method: Transmissive
• Output Configuration: Phototransistor
• Current - Dc Forward (if): 30mA
• Current - Collector (ic) (max): 20mA
• Voltage - Collector Emitter Breakdown (max): 35V
• Response Time: 50µs, 50µs
• Mounting Type: Surface Mount, Gull Wing
• Package / Case: 4-SMD
• Operating Temperature: -25°C ~ 85°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 425-2510-5

■ Manufacturing Guidelines
● Storage and management after open (Only for GP1S196HCZSF)
● Soldering Method
Storage condition
Treatment after opening the moisture-proof package
Baking before mounting
Refl ow Soldering (Only for GP1S196HCZSF) :
Storage temp.: 5 to 30˚C, Storage humidity : 70%RH or less at regular packaging.
After opening, you should mount the products while keeping them on the condition of 5 to 25˚C and 70%RH
or less in humidity within 4 days.
After opening the bag once even if the prolonged storage is necessary, you should mount the products within
two weeks.
And when you store the rest of products you should put into a DRY BOX. Otherwise after the rest of products
and silicagel are sealed up again, you should keep them under the condition of 5 to 30˚C and 70%RH or
less in humidity.
When the above-mentioned storage method could not be executed, please process the baking treatment
before mounting the products.
However the baking treatment is permitted within one time.
∗ Do not process the baking treatment with the product wrapped. When the baking treatment processing, you
Refl ow soldering should follow the temperature profi le shown below.
Soldering should not exceed the curve of temperature profi le and time.
Please solder within one time.
should move the products to a metallic tray or fi x temporarily the products to substrate.
Recommended condition : 125˚C, 16 to 24 hours
MAX
MAX
240˚C
200˚C
160˚C
25˚C
1 to 4˚C/s
8
MAX120s
GP1S196HCZ0F/GP1S196HCZSF
1 to 4˚C/s
MAX90s
MAX60s
MAX10s
Sheet No.: D3-A01001EN
1 to 4˚C/s