GP1S53VJ000F Sharp Microelectronics, GP1S53VJ000F Datasheet - Page 9

• Manufacturer Part Number: GP1S53VJ000F
• Description: SENSOR OPTO SLOT 5MM TRANS THRU
• Manufacturer: Sharp Microelectronics
• Type: Unamplifiedr

Specifications of GP1S53VJ000F

• Sensing Distance: 0.197" (5mm)
• Sensing Method: Transmissive
• Output Configuration: Phototransistor
• Current - Dc Forward (if): 50mA
• Current - Collector (ic) (max): 20mA
• Voltage - Collector Emitter Breakdown (max): 35V
• Response Time: 3µs, 4µs
• Mounting Type: Through Hole
• Package / Case: 4-SIP
• Operating Temperature: -25°C ~ 85°C
• No. Of Channels: 1
• Input Current: 20mA
• Output Voltage: 35V
• Opto Case Style: Through Hole
• No. Of Pins: 4
• Collector Emitter Voltage V(br)ceo: 35V
• Continuous Collector Current Ic Max: 5mA
• External Depth: 5.2mm
• Output Collector Emitter Voltage (detector): 35 V
• Maximum Reverse Voltage (emitter): 6 V
• Maximum Collector Current (detector): 20 mA
• Slot Width: 5 mm
• Aperture Width: 0.5 mm
• Output Device: Phototransistor
• Power Dissipation: 75 mW
• Maximum Fall Time: 20000 ns
• Maximum Operating Temperature: + 85 C
• Maximum Rise Time: 15000 ns
• Minimum Operating Temperature: - 25 C
• Optocoupler Output Type: Phototransistor
• Svhc: No SVHC (15-Dec-2010)
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 425-1972; 425-1972-5; 425-1972-5

■ Manufacturing Guidelines
● Soldering Method
Flow Soldering:
Hand soldering
Other notice
Flux
Soldering should be completed below 260˚C and within 5 s.
Please take care not to let any external force exert on lead pins.
Please don't do soldering with preheating, and please don't do soldering by refl ow.
Hand soldering should be completed within 3 s when the point of solder iron is below 350̊C.
Please solder within one time.
Please don't touch the terminals directly by soldering iron.
Soldered product shall treat at normal temperature.
Please test the soldering method in actual condition and make sure the soldering works fine, since the
impact on the junction between the device and PCB varies depending on the cooling and soldering
conditions.
Some fl ux, which is used in soldering, may crack the package due to synergistic effect of alcohol in fl ux and
the rise in temperature by heat in soldering. Therefore, in using fl ux, please make sure that it does not have
any infl uence on appearance and reliability of the photointerrupter.
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Sheet No.: D2-A02601EN
GP1S53VJ000F