HTMS8201FTB/AF,115 NXP Semiconductors, HTMS8201FTB/AF,115 Datasheet - Page 4

• Manufacturer Part Number: HTMS8201FTB/AF,115
• Description: RFID HTAG ADVANCED SOT1122
• Manufacturer: NXP Semiconductors
• Series: HITAG® µr

Specifications of HTMS8201FTB/AF,115

• Rf Type: Read / Write
• Frequency: 100kHz ~ 150kHz
• Features: ISO/IEC 11784/11785
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935290073115

NXP Semiconductors
3. Ordering information
Table 1.
152931
Product data sheet
PUBLIC
Type number
HTMS1001FUG/AM
HTMS1101FUG/AM
HTMS1201FUG/AM
HTMS8001FUG/AM
HTMS8101FUG/AM
HTMS8201FUG/AM
HTMS1001FTB/AF
HTMS1101FTB/AF
HTMS1201FTB/AF
HTMS8001FTB/AF
HTMS8101FTB/AF
HTMS8201FTB/AF
HTMS1001FTK/AF
HTMS1101FTK/AF
HTMS1201FTK/AF
HTMS8001FTK/AF
HTMS8101FTK/AF
HTMS8201FTK/AF
Ordering information
Package
Name
Wafer
Wafer
Wafer
Wafer
Wafer
Wafer
XSON3
XSON3
XSON3
XSON3
XSON3
XSON3
HVSON2
HVSON2
HVSON2
HVSON2
HVSON2
HVSON2
Description
sawn, megabumped wafer, 150 µm, 8 inch, UV HITAG μ, 210pF
sawn, megabumped wafer, 150 µm, 8 inch, UV HITAG μ advanced,
sawn, megabumped wafer, 150 µm, 8 inch, UV HITAG μ advanced+,
sawn, megabumped wafer, 150 µm, 8 inch, UV HITAG μ, 280pF
sawn, megabumped wafer, 150 µm, 8 inch, UV HITAG μ advanced,
sawn, megabumped wafer, 150 µm, 8 inch, UV HITAG μ advanced+,
plastic extremely thin small outline package; no
leads; 4 terminals; body 1 x 1.45 x 0.5 mm
plastic extremely thin small outline package; no
leads; 4 terminals; body 1 x 1.45 x 0.5 mm
plastic extremely thin small outline package; no
leads; 4 terminals; body 1 x 1.45 x 0.5 mm
plastic extremely thin small outline package; no
leads; 4 terminals; body 1 x 1.45 x 0.5 mm
plastic extremely thin small outline package; no
leads; 4 terminals; body 1 x 1.45 x 0.5 mm
plastic extremely thin small outline package; no
leads; 4 terminals; body 1 x 1.45 x 0.5 mm
plastic thermal enhanced very thin small outline
package; no leads; 2 terminals; body 3 x 2 x
0.85 mm
plastic thermal enhanced very thin small outline
package; no leads; 2 terminals; body 3 x 2 x
0.85 mm
plastic thermal enhanced very thin small outline
package; no leads; 2 terminals; body 3 x 2 x
0.85 mm
plastic thermal enhanced very thin small outline
package; no leads; 2 terminals; body 3 x 2 x
0.85 mm
plastic thermal enhanced very thin small outline
package; no leads; 2 terminals; body 3 x 2 x
0.85 mm
plastic thermal enhanced very thin small outline
package; no leads; 2 terminals; body 3 x 2 x
0.85 mm
Rev. 3.1 — 21 January 2010
152931
Type
210pF
210pF
280pF
280pF
HITAG μ, 210pF
HITAG μ advanced,
210pF
HITAG μ advanced+,
210pF
HITAG μ, 280pF
HITAG μ advanced,
280pF
HITAG μ advanced+,
280pF
HITAG μ, 210pF
HITAG μ advanced,
210pF
HITAG μ advanced+,
210pF
HITAG μ, 280pF
HITAG μ advanced,
280pF
HITAG μ advanced+,
280pF
© NXP B.V. 2010. All rights reserved.
HITAG µ
Transponder IC
Version
-
-
-
-
-
-
SOT1122
SOT1122
SOT1122
SOT1122
SOT1122
SOT1122
SOT899-1
SOT899-1
SOT899-1
SOT899-1
SOT899-1
SOT899-1
4 of 58