DC-WME-01T-JT Digi International, DC-WME-01T-JT Datasheet - Page 7

• Manufacturer Part Number: DC-WME-01T-JT
• Description: MODULE WI-ME CUSTOMIZABLE JTAG
• Manufacturer: Digi International
• Series: Digi Connect® Wi-MEr

Specifications of DC-WME-01T-JT

• Frequency: 2.4GHz
• Data Rate - Maximum: 11Mbps
• Modulation Or Protocol: 802.11 b
• Applications: General Purpose
• Power - Output: 16dBm
• Sensitivity: -82dBm
• Voltage - Supply: 3.14 V ~ 3.45 V
• Data Interface: PCB, Through Hole
• Memory Size: 4MB Flash, 8MB RAM
• Antenna Connector: RP-SMA
• Operating Temperature: -30°C ~ 75°C
• Package / Case: Module
• Wireless Frequency: 2.4 GHz
• Interface Type: SMA
• Modulation: CCK, DBPSK, DQPSK
• Security: 64/128 WEP, WPA, 802.11i, TKIP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Transmitting: -
• Current - Receiving: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: NS7520
• Other names: 602-1002

About the Integration Kit
About the Development Kit
Scope of the Reference Manual
Kits Contents
About This Document
The purpose of this document is to enable developers to integrate the Digi Connect ME or
Digi Connect Wi-ME embedded modules with other devices, enabling these devices to
make use of the module’s rich networking features.
Note
This manual is intended for customers who use embedded modules Integration Kits or
Development Kits, which are described below.
The integration kit is the ideal platform for product evaluation, rapid prototyping, and
integration of the embedded modules. Targeted specifically at customers who want to take
advantage of the embedded modules with Digi plug-and-play firmware functionality, it
enables integration of the modules without any extensive embedded software development
with all the additional flexibility and benefits of web user interface customization and
application specific java applets.
The Digi Connect ME or Digi Connect Wi-ME Development Kit are easy-to-use and
royalty-free development platforms that significantly reduces traditional design risk and
accelerates the overall software development process. The kits deliver the integrated
• • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • •
Unless mentioned specifically by name, the products will be referred to as the
embedded modules or modules. Individual naming is used to differentiate
product specific features.
n n n