ETRX2 Telegesis Ltd, ETRX2 Datasheet - Page 20

MODULE ZIGBEE EM250 CHIP ANT

ETRX2

Manufacturer Part Number
ETRX2
Description
MODULE ZIGBEE EM250 CHIP ANT
Manufacturer
Telegesis Ltd
Datasheets

Specifications of ETRX2

Frequency
2.4GHz
Data Rate - Maximum
250kbps
Modulation Or Protocol
802.15.4 Zigbee
Applications
ISM
Power - Output
3dBm
Sensitivity
-98dBm
Voltage - Supply
2.1 V ~ 3.6 V
Current - Receiving
35.5mA
Current - Transmitting
35.5mA
Data Interface
PCB, Surface Mount
Memory Size
128kB Flash, 5kB SRAM
Antenna Connector
On-Board, Chip
Operating Temperature
-40°C ~ 85°C
Package / Case
Module
Module Applications
AMR, Building Automation, Wireless Sensor Network, M2M Industrial Controls
Mcu Supported Families
EM250
Processor Type
EM250
Wireless Protocol
IEEE 802.15.4
Data Rate
250Kbps
Module Interface
I2C, SPI, UART
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
920-1000-2
13 Soldering Temperature Time Profile (for reflow soldering)
13.1 For Lead Solder
13.2 For Lead-free Solder
NB:
Maximum Reflow Cycles: 2
Opposite-side reflow is prohibited due to the modules weight. (i.e. you must not place the
module on the bottom / underside of your pcb and re-flow).
©2009 Telegesis (UK) Ltd
Recommended temp. profile
for reflow soldering
Our used temp. profile
for reflow soldering
Temp
Temp
150°C – 190°C
.[°C]
.[°C]
150 ±10°C
230°C -250°C max.
Figure 5: Temperature Profile for Lead-free Solder
Figure 4: Temperature Profile for Lead Solder
235°C max.
220 ±5°C
200°C
220°C
- 20 -
90 ±30s
90 ±30s
ETRX2 Product Manual (Rev 1.09)
30 +20/-10s
30 +20/-10s
10 ±1s
Time [s]
Time [s]
ETRX2

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