MC13202FCR2 Freescale Semiconductor, MC13202FCR2 Datasheet - Page 20

• Manufacturer Part Number: MC13202FCR2
• Description: IC TXRX RF 2.4GHZ 32-QFN
• Manufacturer: Freescale Semiconductor

Specifications of MC13202FCR2

• Frequency: 2.4GHz
• Data Rate - Maximum: 250kbps
• Modulation Or Protocol: 802.15.4
• Applications: AMR, HID, HVAC, ISM
• Power - Output: -27dBm ~ 3dBm
• Sensitivity: -92dBm
• Voltage - Supply: 2 V ~ 3.4 V
• Current - Receiving: 37mA
• Current - Transmitting: 30mA
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-QFN
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Memory Size: -
• Lead Free Status / Rohs Status: Compliant
• Other names: MC13202FCR2; MC13202FCR2TR

Initial tolerance for the internal trim capacitance is approximately ±15%.
Since the MC13202 contains an on-chip reference frequency trim capability, it is possible to trim out
virtually all of the initial tolerance factors and put the frequency within 0.12 ppm on a board-by-board
basis. Individual trimming of each board in a production environment allows use of the lowest cost crystal,
but requires that each board go through a trimming procedure. This step can be avoided by
using/specifying a crystal with a tighter stability tolerance, but the crystal will be slightly higher in cost.
A tolerance analysis budget may be created using all the previously stated factors. It is an engineering
judgment whether the worst case tolerance will assume that all factors will vary in the same direction or if
the various factors can be statistically rationalized using RSS (Root-Sum-Square) analysis. The aging
factor is usually specified in ppm/year and the product designer can determine how many years are to be
assumed for the product lifetime. Taking all of the factors into account, the product designer can determine
the needed specifications for the crystal and external load capacitors to meet the 802.15.4 Standard.
8.2
The suggested crystal specification for the MC13202 is shown in
parameters are related to desired package, desired temperature range and use of crystal capacitive load
trimming. For more design details and suggested crystals, see application note AN3251, Reference
Oscillator Crystal Requirements for MC1319x, MC1320x, MC1321x and MC1322x.
20
1
2
Frequency
Frequency tolerance (cut tolerance)
Frequency stability (temperature drift)
Aging
Equivalent series resistance
Load capacitance
Shunt capacitance
Mode of oscillation
Crystal Requirements
User must be sure manufacturer specifications apply to the desired package.
A wider frequency tolerance may acceptable if application uses trimming at production final test.
4
Parameter
6
Figure 11. MC13202 Modem Crystal Circuit
5
Table 9. MC13202 Crystal Specifications
Y1 = Daishinku KDS - DSX321G ZD00882
MC13202 Technical Data, Rev. 1.5
2
3
U6
MC1320x
XTAL1
XTAL2
16.000000
Value
5 - 9
± 10
± 15
26
27
± 2
43
<2
Y 1
16MHz
MHz
Unit
ppm
ppm
ppm
pF
pF
Ω
at 25 °C
Over desired temperature range
max
max
max
fundamental
C10
6.8pF
C11
6.8pF
Table
9. A number of the stated
1
Condition
Freescale Semiconductor