WISMC03BI Laird Technologies, WISMC03BI Datasheet - Page 16

• Manufacturer Part Number: WISMC03BI
• Description: MODULE LAN 802.11B/G BISM
• Manufacturer: Laird Technologies
• Series: EZURiOr

Specifications of WISMC03BI

• Frequency: 2.4GHz
• Data Rate - Maximum: 1Mbps
• Modulation Or Protocol: 802.11 b/g
• Applications: AMR, Automotive, ISM
• Power - Output: 15dBm
• Sensitivity: -86dBm
• Voltage - Supply: 3.3 V ~ 5.5 V
• Current - Transmitting: 250mA
• Data Interface: Connector, 50 Pin, DF-12
• Memory Size: 64Mbyte Flash, 16MByte SRAM
• Antenna Connector: U.FL
• Operating Temperature: -40°C ~ 85°C
• Package / Case: Module
• Wireless Frequency: 2.412 GHz to 2.484 GHz
• Interface Type: UART
• Board Size: 22.8 mm x 33.8 mm x 7.6 mm
• Modulation: BPSK, CCK, DSSS, QPSK
• Security: WEP 64/128, WPA-PSK, WPA2, TKIP, AES-CCMP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Receiving: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

8.6
The WISM connects to a motherboard by means of a board-to-board connector that is supplied by
Hirose. Mating headers from Hirose are available in different stacking heights, allowing the spacing
between the WISM module and carrier pcb to be changed from 3.5mm to 5.0mm.
Notes: The headers listed above are with boss and metal fitting.
8.7
See
8.8
There are many ways to properly install the Module in the host device. An efficient approach is to
mount the PCB to a frame, plate, rack or chassis. Fasteners can be M1.8 or M2 screws plus suitable
washers, circuit board spacers, or customized screws, clamps, or brackets in 2.2mm diameter holes.
Note that care should be taken to ensure the head of the fixing does not interfere with the circuit.
Nylon fixings are recommended.
The antenna (brown square component on top side of PCB) must not be influenced by any other PCBs,
components or by the housing of the host device. The proximity of the antenna to large metallic objects
can affect the range and performance of the system. Designers should carefully consider the location of
the Module and the type of enclosure material that is used.
To prevent mechanical damage, be careful not to force, bend or twist the Module. Be sure it is
positioned flat against the host device.
DSH_WISMC03_0v97 WISM 40 pin SLIP Data Sheet.doc
Item
Receptacle on Module
Headers DF12 series
Parameter
Number of Contacts
Quantity delivered
Voltage
Current Rating
Resistance
Dielectric Withstanding Voltage
Operating Temperature
Contact Material
Insulator
Stacking height
Insertion force
Withdrawal force 1st to 50th
Maximum connection cycles
http://www.hirose.co.jp/cataloge_hp/e53700036.pdf
Board to board connector and stacking height
Suffix -86 denotes RoHS compliance.
Hirose Connector general specification
Mounting the Module onto the application platform
Part number
DF12C-40DS-0.5V(86)
DF12(3.5)-40DP-0.5V(86)
DF12(4.0)-40DP-0.5V(86)
DF12(5.0)-40DP-0.5V(86)
Specification (40 pin Board to Board connector)
40
2000 Connectors per Tape & Reel
50V
0.5A max per contact
0.05 Ohm per contact
500V RMS min
phosphor bronze (surface: gold plated)
Material PA , beige natural
3.0 mm ; 3.5 mm ; 4.0 mm ; 5.0 mm
21.8N
10N
50
-45°C to +125°C
© 2007-8 EZURiO Ltd
for detail information on the PCB socket.
Stacking height
3.5 mm – 5 mm
3.5 mm
4.0 mm
5.0 mm
HRS number
CL537-0007-7-86
CL537-0032-4-86
CL537-0057-5-86
CL537-0157-0-86
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